Method for encapsulating integrated circuit

Details Method for encapsulating integrated circuit Method for encapsulating integrated circuit

1992-07-30

1994-01-04

Pianalto, Bernard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427400, B05D 512

Patent

active

052758419

ABSTRACT:
A silicone gel encapsulated integrated circuit (12) is placed in a container, the container being partially filled with a silicone elastomer (16) which is much more rugged than the gel. After the elastomer (16) hardens, it completely covers the gel encapsulation (14) and protects it and the integrated circuit device from the effects of rough handling. The gel, however, gives all of the protection from the external environment that it would in the absence of the elastomer encapsulation.

REFERENCES:
"Electrical Performance and Reaction Kinetics of Silicone Gels," C. P. Wong, Journal of Material Research, vol. 5, No. 4, Apr. 1990, pp. 795-800.
"Understanding the Use of Silicone Gels for Non-Hermetic Plastic Packaging," C. P. Wong et al., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 2, No. 4, Dec. 1989, pp. 421-425.
"Monolithic High Voltage Gated Diode Crosspoint Array IC," H. T. Weston et al., IEDM Technical Digest (International Electronics Device Meeting), San Francisco, Calif., Dec. 1982, pp. 85-88.

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