Mount apparatus

Details Mount apparatus Mount apparatus

1995-03-23

1997-09-02

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156352, 156378, 73150R, 228 9, 427 9, B32B 3100, G05G 1500

Patent

active

056627637

ABSTRACT:
A mount apparatus according to this invention has a mount head for pressing a semiconductor chip on a mount substrate through an adhesive layer. A position sensor for discretely detecting the position of the mount head in a pressing process every predetermined time interval is arranged in the mount head. A non-defect/defect determination unit is also arranged, and the non-defect/defect determination unit performs non-defect/defect determination of the adhesive layer on the basis of the position detected by the position sensor.

REFERENCES:
patent: 5062566 (1991-11-01), Wood et al.
patent: 5147491 (1992-09-01), Thomas et al.
patent: 5234530 (1993-08-01), Freeman, III
patent: 5246513 (1993-09-01), Yoshida et al.
Partial Translation of Japanese Application, KOKAI Publ. No. 3-263839.

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