Method of cleaning silicon wafers in cleaning baths with control

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

134 32, 134 34, B08B 304, C23G 102

Patent

active

056627432

ABSTRACT:
A novel HF cleaning method of silicon wafers is provided whereby the wafers are cleaned with a lowered level of particle contamination on the surface thereof. In the method silicon wafers are immersed in a HF bath, followed by immersion in a deionized water bath. The silicon wafers are lowered into and lifted out of each bath along a direction which is substantially vertical with respect to a surface of each bath at a rate of from 1 mm/sec to 50 mm/sec. During immersion, a vertical oscillation of the surface of each bath is maintained in the range of less than 4 mm.

REFERENCES:
patent: 5071488 (1991-12-01), Takayama et al.
patent: 5158616 (1992-10-01), Kinoshita et al.
patent: 5277715 (1994-01-01), Cathey
patent: 5346556 (1994-09-01), Perry et al.
patent: 5372651 (1994-12-01), Kodama
patent: 5382296 (1995-01-01), Anttila
patent: 5415698 (1995-05-01), Fujinaga et al.
Journal of the Electrochemical Society, vol. 137, No. 10, Oct. 1, 1990, Akihiro Miyauchi et al. "Low-Temperature (900.degree.C) Si Epitaxial Growth on Si (100) after HF Treatment"; pp. 3257-3260.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of cleaning silicon wafers in cleaning baths with control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of cleaning silicon wafers in cleaning baths with control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of cleaning silicon wafers in cleaning baths with control will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-304865

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.