Stone working – Sawing – Reciprocating
Patent
1997-03-24
1999-08-17
Eley, Timothy V.
Stone working
Sawing
Reciprocating
125 21, B28D 108
Patent
active
059378441
ABSTRACT:
In a wire saw for slicing a cylindrical workpiece such as a silicon ingot so as to obtain wafers or the like, the feed rate of slurry fed to the workpiece, the viscosity of the slurry, or the feed rate of a wire is varied according to the cutting length in the workpiece or the angle between the wire and the circumference of the workpiece. It becomes possible to obtain wafers or the like, each having a uniform thickness.
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Hayakawa Kazuo
Kiuchi Etsuo
Toyama Kohei
Eley Timothy V.
Shin-Etsu Handotai & Co., Ltd.
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