Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2001-04-10
2003-04-29
Paladini, Albert W. (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000, C174S264000, C174S255000, C361S689000, C361S757000, C361S760000, C361S791000, C257S765000, C257S780000
Reexamination Certificate
active
06555757
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates a pin standing resin (pin grid array) substrate, a method of making the same, pins, and a method of making the same, the pin being fabricated with a kovar (Fe—Ni—Co alloy) or a
42
alloy (Ni (42 wt %)—Fe alloy) serving as an input terminal and/or an output terminal thereon.
2. Description of the Related Art
A pin standing resin substrate has conventionally been known where pins as input and output terminals are stood on a resin substrate comprising a resin or a composite material containing a resin.
For example,
FIG. 10
shows a partially enlarged cross sectional view of the pin standing resin substrate
201
. The pin standing resin substrate
201
comprises a resin substrate
203
having a substantially rectangular and substantially plate-like (plated) shape and a lot of pins
221
stood thereon.
Of the two members, the resin substrate
203
has a resin insulating layer
205
formed with wired layers (not shown) inside or in a surface thereof, and many pin-pads
209
exposed from a solder resist layer
207
are formed on the main surface
203
A (an upper portion in FIG.
10
).
On the other hand, the pin
221
comprises the kovar, and comprises a rod like portion
221
A of almost columnar shape and an enlarged diameter portion
221
B of almost disk shape formed on the pin-pad
209
. The pin
221
is fixed to the resin substrate
203
by connecting the whole enlarged diameter portion
221
B and a part of the rod like portion
221
A to the pin-pad
209
by means of a solder HD.
However, in such a pin standing resin substrate
201
, in case the pin
221
receives a load, for example, when pulling the pin
221
, the pin
221
(the rod like portion
221
A) is not broken but, prior to this breaking, the resin substrate
203
(the pin-pad
209
and a lower portion thereof) is destroyed, and the solder-connected portion of the pin
221
and the pin-pad
209
might be destroyed.
In particular, for forming lots of inlet and outlet terminals on the resin substrates
203
, it has been demanded to reduce pins in size and height. For example, in the pin standing resin substrate of reducing the diameter of the pin-pad
209
to be 0.9 to 1.1 mm, demands are that a total full length of the rod like portion and the enlarged diameter portion of the pin
221
is about 2 mm, a diameter of the rod like portion is about 0.3 mm, a diameter of the enlarged diameter portion is below 0.7 mm and a thickness thereof is under 0.2 mm. On the other hand, although such small sized pins are used, further demands are that bonding strength should be maintained high, for example, tensile strength at a 30 degree obliquity (tensile strength inclined 30 degrees) is to be 25.5 N (=2.60 kgf) or more, and further a minimum value is to be 22.2 N (=2.27 kgf) or more.
However, with respect to the pin standing resin substrates employing such small sized pins and pin-pads, although sizes are changed within ranges allowed in the above mentioned pins, requisite bonding strength (the tensile strength at the 30degree obliquity is 25.5 N or more in the average value, and 22.2 N or more in the minimum value) could not be satisfied.
SUMMARY OF THE INVENTION
The present invention has been realized in view of such circumstances, and it is an object of the invention to offer a pin standing resin substrate, the pin of which is less to be broken in case of receiving stress on pins, a method of making the same, pins to be used to the pin standing substrate, and a method of making the same.
REFERENCES:
patent: 4060828 (1977-11-01), Satonaka
patent: 4176443 (1979-12-01), Iannuzzi et al.
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4539582 (1985-09-01), Kuromaru
patent: 4672739 (1987-06-01), Churchwell et al.
patent: 4755631 (1988-07-01), Churchwell et al.
patent: 4974052 (1990-11-01), Ichiyama
patent: 5293073 (1994-03-01), Ono
patent: 5298793 (1994-03-01), Kotani et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 63-272061 (1988-11-01), None
patent: 6-21312 (1994-01-01), None
patent: 2000-049252 (2000-02-01), None
patent: 2000-164786 (2000-06-01), None
Miyamoto Noritaka
Saiki Hajime
Alcala José H.
Morgan & Lewis & Bockius, LLP
NGK Spark Plug Co. Ltd.
Paladini Albert W.
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