Special receptacle or package – Holder for a removable electrical component – Including component positioning means
Reexamination Certificate
2000-11-09
2003-01-14
Yu, Mickey (Department: 3728)
Special receptacle or package
Holder for a removable electrical component
Including component positioning means
C206S725000, C206S724000, C220S004270
Reexamination Certificate
active
06505741
ABSTRACT:
BACKGROUND OF THE INVENTION AND RELATED ART STATEMENT
The present invention relates to a tray for receiving semiconductor devices, and more specifically, it relates to a tray for receiving semiconductor devices which is injection molded by using conductive plastics.
Recently, miniaturization of semiconductor devices (IC) through large-scale integration is advancing, and they are developing from a pin grid array (PGA) type to a ball grid array (BGA), and furthermore to a land grid array (LGA).
In order to stock and transport these semiconductor devices, specific receiving trays (herein after, simply called tray) are used. These trays are used naturally in order to protect the semiconductor devices in handling, as well as to make handling easier in both manual and automatic loading operations.
Also, in manufacturing of these trays, rapid response to the speed of development of the semiconductor devices is required. Furthermore, in addition to reduction of cost, shortening of delivery period is required.
Numerous trays for housing the aforementioned PGA type, BGA type, and LGA type semiconductor devices have been developed and provided to be adapted to the shapes of the semiconductor devices, and one example is shown in FIG.
11
and FIG.
12
. These drawings do not show the entire tray, but rather, they show only one partition for housing one of a large number of arranged semiconductor devices. FIG.
11
(
a
) shows a plan view of this partition, and FIG.
11
(
b
) shows a sectional view taken along line
11
(
b
)—
11
(
b
) in FIG.
11
(
a
). FIG.
12
(
a
) shows a sectional view taken along line
12
(
a
)—
12
(
a
) in FIG.
11
(
a
), and FIG.
12
(
b
) shows a bottom view of FIG.
11
(
a
). The semiconductor device received in this tray is a BGA type.
This tray overall has a rectangular shape, and supporting parts
101
and
102
are formed horizontally and vertically, that is, with beams in a matrix form, inside a frame (not illustrated) following the external shape of the tray. An open pocket
103
is formed by these supporting parts
101
and
102
. On the bottom side of the supporting parts
101
,
102
, flat strip shaped ribs
101
a
and
102
a
are formed to project downwardly therefrom. A semiconductor device
105
is supported at the outer perimeter of the substrate part
105
a
thereof by the surfaces
101
b
and
102
b
on a plane formed by supporting parts
101
and
102
following the perimeter of that pocket
103
.
Also, as shown in FIG.
11
(
b
), supporting parts
101
c
and
102
c
are formed on the ribs
101
a
and
102
a
formed on the bottom sides of the aforementioned the supporting parts
101
and
102
, and supporting surfaces
101
d
and
102
d
consisting of slopes and planes formed by the tips of these supporting parts
101
c
and
102
c
also can support the semiconductor device
105
. These supporting surfaces
101
d
and
102
d
support the semiconductor devices when the trays are stacked and inverted, and they support an encapsulating resin part
105
b
of the semiconductor device
105
.
A large number of the aforementioned semiconductor devices
105
is received by being mounted on the top side, that is, on the aforementioned supporting surfaces
101
a
and
102
b.
Also, other trays are stacked on top of this filled tray and they are placed in a mutually coupled state such that stocking and transporting, and the like, can be performed.
Incidentally, in regard to the aforementioned semiconductor device
105
, the work of inspection, and the like, is performed in a state when it is mounted on the aforementioned tray. This inspection work, and the like, is performed not only from the top side of the semiconductor device
105
, but also from the bottom side. When performing inspection, and the like, with respect to the top side of the semiconductor device, one may go through the working procedure while maintaining the posture of the tray, that is, with the top side placed upright. On the other hand, when performing inspection, and the like, with respect to the bottom side of the semiconductor device, it is performed in the following manner. That is, the group of trays stacked with the top side placed upright is inverted all together. By this, the semiconductor devices supported on a given tray come to be supported by supporting surfaces
101
d
and
102
d
on the bottom side of the tray now being on the lower side (refer to FIG.
11
(
b
)).
By using a tray such as the aforementioned one, the stocking and transporting of the semiconductor devices
105
, as well as all kinds of operations with respect to the semiconductor device
105
, can be made easier. However, because the aforementioned tray has a large number of ribs in addition to the supporting parts
101
and
102
in matrix form so as to support the semiconductor devices on these beam shaped supporting parts and ribs, and because this tray has acute angular parts, the mold used for molding requires expensive discharge processing, and the like, and it is difficult to reduce the cost.
Also, a tray of such shape has problems such as that it is difficult to make the thickness uniform across the entirety, and warping and buckling tend to occur, and that short shot, which is a phenomenon where the melted resin does not completely spread across, occurs at the fine ribs.
Also, since the outer perimeter of the semiconductor device
105
is supported when performing inspection, and the like, of the top side of the semiconductor device, and the outer perimeter of the encapsulating resin part
105
b
is supported when performing inspection, and the like, of the bottom side, a considerable difference arises in the two states of support. Specifically, there is a problem that the postures of the semiconductor devices during inspection of the tops and bottoms of the semiconductor devices are not constant, and the postures of the semiconductor devices on the tray may differ at the tops and the bottoms, and when the semiconductor devices are moved by inverting the tray, their postures change. This point is more prominent as the semiconductor devices are smaller.
Furthermore, in considering the handling of a plurality of kinds of the semiconductor devices having the same external shape, according to the conditions of placement of the balls, i.e. contacts, of the semiconductor devices, the tray described previously can handle those where this ball placement part fits inside the aforementioned pocket
103
, but it can not be used for those where it doesn't fit. Also, since the outer perimeter of the encapsulating resin part
105
b
is supported when supporting the semiconductor devices with the tray inverted, there is a problem that the kinds of the semiconductor devices handled is limited also according to the shape of this encapsulating resin part.
The present invention has been made in consideration of the problems of the aforementioned prior art, and an object of the invention is to provide a tray for receiving semiconductor devices that is of simple constitution and is cheap in cost.
Another object of the invention is to provide a tray for receiving the semiconductor devices as stated above, which prevents deformation, such as warping, and is well-suited for measurement, and the like, from the top and bottom of the semiconductor.
A further object of the invention is to provide a tray for receiving the semiconductor devices as stated above, which can handle many kinds of the semiconductor devices and has high general usability.
Further objects and advantages of the invention will be apparent from the following description of the invention.
SUMMARY OF THE INVENTION
In order to achieve the aforementioned objects, the present invention is directed to a tray for receiving semiconductor devices that receives and arranges flat-type semiconductor devices, wherein a plurality of columnar bosses that couple with the outer perimeters of the semiconductor devices is integrally formed on supporting surfaces that support the semiconductor devices so as to surround the semiconductor devices.
Also, in the tray for receiv
Arnold Troy
Yu Mickey
LandOfFree
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