Method of producing a leadframe

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

H01R 4316

Patent

active

052711480

ABSTRACT:
A leadframe includes a dambar separated from the to be formed molded package edge by temporary slugs. The temporary slugs are partially stamped through the thickness of the leadframe and are then pushed back into position. During encapsulation, unwanted encapsulation or flash flow is prevented from flowing farther than the closest edge of the temporary slugs. In a subsequent operation, the dambar and slugs are punched away in a single operation.

REFERENCES:
patent: 4490902 (1985-01-01), Eytcheson et al.
patent: 4627159 (1986-12-01), Waldner
patent: 4633583 (1987-01-01), Kato
patent: 4942455 (1990-07-01), Shinohara

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