Electric heating – Metal heating – By arc
Reexamination Certificate
2000-03-15
2003-01-21
Dunn, Tom (Department: 1725)
Electric heating
Metal heating
By arc
C219S121720, C219S121750, C219S121600, C219S121670, C219S121710, C219S066000, C136S244000
Reexamination Certificate
active
06509546
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates to a method and associated structure for excising laminate chip carriers from a panel.
2. Related Art
Conventional methods of excising laminate chip carriers from a production panel, such as methods using mechanical routing and diamond saws, require a “kerf” or finite separation between excised chip carriers, which limits the number of chip carriers that can be formed from a given panel. The practical kerf width is typically at least about 1.5 mm inasmuch as the fabrication cost becomes prohibitively too expensive if the kerf width is below about 1.5 mm. This minimum kerf width of 1.5 mm is about 30% of the width of the 5 mm chip carriers in current use. In addition, chip carriers that include advanced materials (e.g., a copper-Invar-copper sandwich) are difficult to machine with mechanical methods.
A method is needed for excising chip carriers from a panel, wherein the method is suitable for advanced materials (e.g., a copper-Invar-copper sandwich) currently used in multilayered structures, and wherein the kerf width is negligibly small.
SUMMARY OF THE INVENTION
The present invention provides a method for excising cells of a panel, comprising the steps of:
focusing a laser beam on a surface of a panel, wherein the laser beam has a wavelength between about 500 nanometers and about 600 nanometers; and
moving the panel relative to the laser beam in a geometric pattern, such that at least one cell of the panel is excised.
The present invention provides a laser structure, comprising:
a panel having an organized configuration of at least two adjacent cells, wherein a kerf between said adjacent cells has a width between about 2 microns and about 75 microns; and
a laser beam focused within the kerf, wherein the laser beam has a wavelength between about 500 nanometers and about 600 nanometers.
The present invention has the advantage of providing a method for forming chip carriers from a panel, such that the kerf width is negligibly small.
The present invention has the advantage of being suitable for advanced materials (e.g., , a copper-Invar-copper sandwich), currently used in multilayered structures.
The present invention has the advantage of being relatively inexpensive; i.e.; the present invention has little or no consumables, while the routers bits and diamond saws of conventional methods must be replaced periodically.
REFERENCES:
patent: 3410979 (1968-11-01), Larsson
patent: 3626141 (1971-12-01), Daly
patent: 4054479 (1977-10-01), Peiffer
patent: 4092515 (1978-05-01), Joslin et al.
patent: 4156807 (1979-05-01), Howard et al.
patent: 4205278 (1980-05-01), George et al.
patent: 4820897 (1989-04-01), Lefevre
patent: 4853758 (1989-08-01), Fischer
patent: 4915981 (1990-04-01), Traskos et al.
patent: 4964212 (1990-10-01), Deroux-Dauphin et al.
patent: 5034591 (1991-07-01), Fang
patent: 5057664 (1991-10-01), Johnson et al.
patent: 5059256 (1991-10-01), Kanapenas et al.
patent: 5236551 (1993-08-01), Pan
patent: 5260963 (1993-11-01), Baird et al.
patent: 5323414 (1994-06-01), Baird et al.
patent: 5453134 (1995-09-01), Arai et al.
patent: 5460921 (1995-10-01), Cywar et al.
patent: 5473624 (1995-12-01), Sun
patent: 5584956 (1996-12-01), Lumpp et al.
patent: 5590141 (1996-12-01), Baird et al.
patent: 5593606 (1997-01-01), Owen et al.
patent: 5609746 (1997-03-01), Farrar et al.
patent: 5614114 (1997-03-01), Owen
patent: 5628926 (1997-05-01), Belgacem et al.
patent: 5666722 (1997-09-01), Tamm et al.
patent: 5702565 (1997-12-01), Wu et al.
patent: 5703631 (1997-12-01), Hayes et al.
patent: 5759428 (1998-06-01), Balamane et al.
patent: 5808272 (1998-09-01), Sun et al.
patent: 5841099 (1998-11-01), Owen et al.
patent: 5843363 (1998-12-01), Mitwalsky et al.
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 5887520 (1999-03-01), Kinoshita
patent: 6060683 (2000-05-01), Estrada
patent: 6077722 (2000-06-01), Jansen et al.
patent: 6099522 (2000-08-01), Knopp et al.
patent: 6131266 (2000-10-01), Saunders
patent: 6168744 (2001-01-01), Malshe et al.
patent: 6343369 (2002-01-01), Saunders et al.
Egitto Frank D.
Kresge John S.
Dunn Tom
Edmondson L.
Samodovitz Arthur J.
LandOfFree
Laser excision of laminate chip carriers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laser excision of laminate chip carriers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser excision of laminate chip carriers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3004892