Method of manufacturing a semiconductor chip carrier

Details Method of manufacturing a semiconductor chip carrier Method of manufacturing a semiconductor chip carrier

1995-06-05

1998-10-13

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29842, 29845, H05K 330, H01R 900

Patent

active

058194037

ABSTRACT:
A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads. A method of manufacturing a semiconductor die carrier includes the steps of individually manufacturing a plurality of electrically conductive leads without use of a lead frame; extending a plurality of the electrically conductive leads from at least one of a plurality of electrically insulative side walls; positioning a semiconductor die such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and electrically connecting the semiconductor die to corresponding ones of the electrically conductive leads.

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