Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-12-20
2003-09-30
Martin, David (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S767000, C361S803000, C361S790000, C361S784000, C361S760000, C029S832000, C029S835000, C174S050510, C174S250000, C174S260000
Reexamination Certificate
active
06628527
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a unit interconnection substrate and an interconnection substrate for forming a mount structure of electronic parts or an electronic device obtained by mounting a plurality of leadless type semiconductor chips or other electronic parts superposed on each other in two or more stages on a mount substrate, a mount structure of electronic parts and an electronic device formed by using those, a method for mounting electronic parts for forming the mount structure of the electronic parts and a method for manufacturing an electronic device for forming such an electronic device.
2. Description of the Related Art
Conventionally, a mount structure of electronic parts or an electronic device as shown in
FIG. 13
has been known.
In this mount structure of electronic parts or electronic device, two or more thin small outline package (TSOP) type semiconductor chips or other electronic parts
60
are superposed on each other on a mount substrate
80
. Then, each of the leads
64
extended to the plurality of semiconductor chips or other electronic parts
60
is superposed on each other on conductor pads
92
provided on a top surface of the mount substrate
80
corresponding to those and electrically connected by soldering or the like.
Summarizing the problem to be solved by the invention, recently, for the purpose for improving the electrical characteristics of the semiconductor chips or other electronic parts and the purpose of reducing the mount area of the electronic parts, types have appeared for electrically connecting a semiconductor chip directly to the conductor pads of the mount substrate by a flip chip bonding and surface mounting the semiconductor chip on the mount substrate or types have appeared for electrically connecting a chip size package (CSP) type semiconductor device to the conductor pads of the mount substrate and surface mounting the semiconductor device on the mount substrate. These are employed in many electronic apparatuses.
In a semiconductor chip or semiconductor substrate of the type to be surface mounted on this mount substrate, the leads are not extended, so it is impossible to mount two or more leadless type semiconductor chips or semiconductor devices or other electronic parts superposed on the mount substrate.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a unit interconnection substrate and an interconnection substrate for mounting a plurality of leadless type electronic parts as described above superposed in two or more stages on a mount structure, a mount structure of electronic parts and an electronic device formed by using the same, a method for mounting electronic parts for forming the mount structure of the electronic parts, and a method for manufacturing an electronic device for forming an electronic device.
To attain the above object, according to a first aspect of the present invention, there is provided a unit interconnection substrate comprised of an insulating substrate, an interconnection circuit provided with connection terminals and conductor pads provided on a top surface of the insulating substrate, a depression for holding an electronic part formed in a bottom surface of the insulating substrate, and connection terminals provided on the bottom surface of the insulating substrate on the periphery of the depression, the connection terminals being electrically connected to the connection terminals provided on the interconnection circuit via conductor through holes or conductor via holes provided in the insulating substrate.
Preferably, a plurality of unit interconnection substrates of the present invention are integrally formed arranged in many columns or one column.
According to a second aspect of the present invention, there is provided a first mount structure of electronic parts wherein an electronic part is electrically connected to conductor pads provided on interconnection circuits of the top surface of a unit interconnection substrate or other interconnection substrate, the electronic part is mounted on the unit interconnection substrate or interconnection substrate, the connection terminals of the bottom surface of the unit interconnection substrate or the interconnection substrate are electrically connected to the corresponding connection pads of the mount substrate, and, at the same time, the electronic part mounted on the mount substrate is held in a depression in the bottom surface of the unit interconnection substrate or interconnection substrate.
According to a third aspect of the present invention, there is provided a second mount structure of electronic parts wherein an electronic part is electrically connected to conductor pads provided on an interconnection circuit of a top surface of an unit interconnection substrate or interconnection substrate, a plurality of the unit interconnection substrates or interconnection substrates with electronic parts mounted thereon are superposed in two or more stages on each other, the connection terminals of vertically superposed unit interconnection substrates or interconnection substrates are electrically connected to each other, an electronic part mounted on a lower unit interconnection substrate or interconnection substrate is held in a depression of the bottom surface of an upper unit interconnection substrate or interconnection substrate, connection terminals of the bottom surface of the lowermost unit interconnection substrate or interconnection substrate among the two or more stages of superposed unit interconnection substrates or interconnection substrates are electrically connected to corresponding connection pads of the mount substrate, and an electronic part mounted on a mount substrate is held in the depression of the bottom surface of the lowermost unit interconnection substrate or interconnection substrate.
According to a fifth aspect of the present invention, there is provided a first electronic device comprising the first mount structure of electronic parts in which, in place of the mount substrate, use is made of a unit interposer or an interposer provided on its top surface with conductor pads for connecting an electronic part and connection pads for connecting connection terminals provided on the bottom surface of the unit interconnection substrate or interconnection substrate and provided on its bottom surface with connection pads for connecting an external electronic circuit electrically connected to the connection pads of the top surface.
According to a sixth aspect of the present invention, there is provided a second electronic device comprising the second mount structure of electronic parts in which, in place of the mount substrate, use is made of a unit interposer or an interposer provided on its top surface with conductor pads for connecting electronic parts and connection pads for connecting connection terminals provided on the bottom surface of the unit interconnection substrate or interconnection substrate and provided on its bottom surface with connection pads for connecting an external electronic circuit electrically connected to the connection pads of the top surface.
According to the first or second mount structure of electronic parts of the present invention or the first or second electronic devices of the present invention, leadless type semiconductor chips or other electronic parts can be mounted via the unit interconnection substrate or the interconnection substrate of the present invention on the mount substrate, the unit interposer, or the interposer superposed on each other in two more stages or leadless type semiconductor chips or other electronic parts can be mounted via the unit interconnection substrate or the interconnection substrate of the present invention on the mount substrate, the unit interposer, or the interposer superposed on each other in three or more stages.
Further, other electronic parts other than the electronic part mounted on the uppermost unit interconnection substrate or the uppermost interconnection substrate ca
Kazama Takuya
Muramatsu Shigetsugu
Levi Dameon E.
Martin David
Paul & Paul
Shinko Electric Industries Company, Ltd.
LandOfFree
Mounting structure for electronic parts and manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mounting structure for electronic parts and manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting structure for electronic parts and manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3002124