Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2001-07-16
2002-10-01
Lam, Cathy (Department: 1775)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000, C174S262000, C428S209000
Reexamination Certificate
active
06459044
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a flexible multilayer wiring board applied to a sheet switch used for a thin-type panel switch of vehicle-mounted or home electric equipment.
2. Description of the Related Art
To explain the configuration of a conventional type flexible multilayer wiring board referring to
FIG. 19
, the conventional type flexible multilayer wiring board is formed by mainly bonding a first flat flexible base material
110
and a second flat flexible base material
120
via an adhesive
130
, a first conductive pattern
111
is provided on the unbonded surface of the first flexible base material
110
and a second conductive pattern
121
is provided on the unbonded surface of the second flexible base material
120
.
A through hole
113
is formed in the first flexible base material
110
, a through hole
123
is formed in the second flexible base material
120
, both the through holes
113
and
123
mutually conduct, gold plate
140
is provided to their inner walls and the first conductive pattern
111
and the second conductive pattern
121
conduct.
The first flexible base material
110
is formed by a flat film substrate made of polyimide, the first conductive pattern
111
made of copper foil is formed on the back surface by etching and gold plate
112
is laminated on the first conductive pattern
111
by electrolytic plating.
The second flexible base material
120
is also similarly formed by a flat film substrate made of polyimide, the second conductive pattern
121
made of copper foil is formed on the surface by etching and gold plate
122
is laminated on the second conductive pattern
121
by electrolytic plating.
The first flexible base material
110
and the second flexible base material
120
are bonded via the adhesive
130
provided between them.
At this time, the through holes
113
and
123
are opposed and conduct, the gold plate
140
is provided to the inner walls of these through holes
113
and
123
and is also extended on the reverse side to the through holes
113
and
123
.
The first conductive pattern
111
and the second conductive pattern
121
conduct via this gold plate
140
.
The conventional type flexible multilayer wiring board is manufactured by forming the first conductive pattern
111
on the first flexible base material
110
in a desired shape by etching, laminating the gold plate
112
on it by electrolytic plating and afterward, punching the through hole
113
by a press.
The second flexible base material
120
is also similarly manufactured by forming the second conductive pattern
121
, the gold plate
122
and the through hole
123
.
Afterward, the adhesive
130
is provided to at least one wiring board by desired means such as printing and both base materials are bonded.
Afterward, when the gold plate
140
is applied to the inner wall of the through holes
113
and
123
which mutually communicate by electrolytic plating and the like, and the first conductive pattern
111
and the second conductive pattern
121
conduct, the conventional type flexible multilayer wiring board is completed. As the first and second conductive patterns
111
and
121
are formed by etching, the gold plates
112
and
122
are respectively laminated on the first and second conductive patterns
111
and
121
by electrolytic plating and gold plating is also applied to the through holes
113
and
123
, the conventional type flexible multilayer wiring board has a problem that the cost is increased because the processes are complex and in addition, gold plating is used.
As gold plate
140
is applied to the inner wall of the through holes
113
and
123
, the reliability of the conduction of the first and second conductive patterns
111
and
121
may have a problem depending upon a state in which the gold plate adheres.
SUMMARY OF THE INVENTION
Then, the object of the invention is to provide a flexible multilayer wiring board of which the productivity is satisfactory, which is low-priced and highly reliable in connection.
For first solvable means for solving the above-mentioned problems, first and second flexible base materials of which each one surface is bonded via an adhesive and a first conductive body that electrically connects a first conductive pattern formed on the unbonded surface of the first flexible base material with a second conductive pattern formed on the second flexible base material are provided, the first flexible base material is provided with a first through hole and a connection which is formed around the first through hole on the side of the unbonded surface and which conducts with the first conductive pattern, space is provided between the periphery on the side of the bonded surface of the first through hole of the first flexible base material and the second flexible base material, an air path via which air in the space can escape is provided between the first and second flexible base materials, conductive paste forming the first conductive body is filled in the space via the first through hole, the connection and the second conductive pattern are electrically connected and when the conductive paste is filled in the space, air in the space escapes via the air path.
For second solvable means, the air path is formed by a part where the adhesive is not formed.
For third solvable means, an air port of the air path is provided at the peripheral end of at least one of the first flexible base material and the second flexible base material.
For fourth solvable means, the air port of the air path is provided to a mounting hole provided to mount the first and second flexible base materials.
For fifth solvable means, the second conductive pattern is formed on the side of the bonded surface of the second flexible base material and the first conductive body is touched to at least a part of the second conductive pattern.
For sixth solvable means, the second conductive pattern is formed on the side of the unbonded surface of the second flexible base material, a second through hole is provided in a position opposite to the first through hole in the second flexible base material, a second conductive body is filled in the second through hole, and the first and second conductive patterns conduct via the second conductive body.
For seventh solvable means, the first conductive body is formed by the screen printing of conductive paste.
For eighth solvable means, an insulating resist layer is respectively provided on the side of each bonded surface of the first and second flexible base materials and these resist layers are bonded via the adhesive.
REFERENCES:
patent: 4691188 (1987-09-01), Watanabe et al.
patent: 5448020 (1995-09-01), Pendse
patent: 5499444 (1996-03-01), Doans, Jr. et al.
patent: 5997983 (1999-12-01), Caron et al.
patent: 6010769 (2000-01-01), Sasaoka et al.
patent: 6162996 (2000-12-01), Schmidt et al.
Shinano Kenichi
Watanabe Yasushi
Alps Electric Co. ,Ltd.
Beyer Weaver & Thomas LLP
Lam Cathy
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