Heat-dissipating assembly

Details Heat-dissipating assembly Heat-dissipating assembly

2001-07-30

2002-12-10

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S697000, C415S176000, C415S177000, C415S178000

Reexamination Certificate

active

06493225

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a heat-dissipating assembly, and more particularly to a heat-dissipating assembly for being used in a system frame.
BACKGROUND OF THE INVENTION
The heat-dissipation is always the essential problem in application of electric products. A good heat-dissipating mechanism usually represents a stable performance of the electric device. On the other hand, an electric device operated under an abnormal-dissipating condition will inevitably lead to an unstable performance and reduce the operation life of the electric device.
Currently, many high-level electric appliances have heat-dissipating devices that are hot swappable. When the heat-dissipating device is malfunctioned in operation, the heat-dissipating device itself could be online replaced without turning off the electric appliance. For example, a hot swappable heat-dissipating device is widely used to a server of a computer system.
FIG. 1
is a schematic view of a conventional heat-dissipating device
11
. The heat-dissipating device
11
has a first terminal connector
18
for connecting with a second terminal connector (not shown) of a system frame when the heat dissipating device
11
is placed into the system frame. In addition, the heat-dissipating device
11
is engaged with a securing seat
13
, and fasteners
15
are fastened to a first aperture
16
of the securing seat
13
and a second aperture
14
of the heat-dissipating device
11
.
When the heat-dissipating device
11
is malfunctioned in operation, the heat-dissipating device
11
could be disassembled and replaced without turning off the system. However, replacing such heat-dissipating assembly is costly and time-consuming because the heat-dissipating device
11
together with the securing seat
13
and the terminal connector
17
need to be replaced.
In order to overcome drawbacks described above, the present invention provides a heat-dissipating assembly for overcoming the drawbacks described above.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a heat-dissipating assembly for being used in a system frame.
In accordance with the present invention, the heat-dissipating assembly includes a heat-dissipating device having a plurality of holes thereon, and a securing device engaged with the system frame and having a plurality of engaging elements corresponding to the plurality of holes of the heat-dissipating device for separately connecting the heat-dissipating device with the securing device, and a plurality of supporting flanges for assisting in securing the heat-dissipating device to the securing device.
Certainly, the heat-dissipating device could be a fan.
Preferably, the securing device is L-shaped.
In addition, the securing device further includes a retractable terminal receiver for receiving a terminal of the heat-dissipating device when the heat-dissipating device is connected with the securing device. The securing device further has a receptacle for receiving the terminal receiver, and a resilient arm having a slot thereon and disposed adjacent to the receptacle for supporting the terminal receiver received in the receptacle of the securing device.
Furthermore, the terminal receiver has a salient for plugging into the slot of the resilient arm.
It is another object of the present invention to provide a heat-dissipating assembly for being used in a system frame.
In accordance with the present invention, the heat-dissipating assembly includes a heat-dissipating device having at least one terminal thereon, and a securing device engaged with the system frame and having a retractable terminal receiver for receiving the at least one terminal of the heat-dissipating device to conduct electricity.
Preferably, the securing device is L-shaped.
Certainly, the heat-dissipating device could be a fan.
In accordance with the present invention, the securing device further has a receptacle for receiving the terminal receiver, and a resilient arm having a slot thereon and disposed adjacent to the receptacle for supporting the terminal receiver received in the receptacle of the securing device.
In addition, the terminal receiver has a salient for plugging into the slot of the resilient arm.
Furthermore, the heat-dissipating device further has a plurality of holes and the securing device further has a plurality of engaging elements corresponding to the plurality of holes for assisting in securing the heat-dissipating device to the securing device.
It is another object of the present invention to provide a securing device for being used in a system frame and engaging with a heat-dissipating device having a plurality of holes thereon.
In accordance with the present invention, the securing device includes a plurality of engaging elements corresponding to the plurality of holes of the heat-dissipating device for separately connecting the heat-dissipating device with the securing device, and a plurality of supporting flanges for assisting in securing the heat-dissipating device to the securing device.
Preferably, the securing device is L-shaped.
Certainly, the heat-dissipating device could be a fan.
In addition, the securing device further includes a retractable terminal receiver for receiving a terminal of the heat-dissipating device when the heat-dissipating device is connected with the securing device.
In addition, the securing device further has a receptacle for receiving the terminal receiver, and a resilient arm having a slot thereon and disposed adjacent to the receptacle for supporting the terminal receiver received in the receptacle of the securing device.
Furthermore, the terminal receiver has a salient for plugging into the slot of the resilient arm.
The present invention may best be understood through the following descriptions with reference to the accompanying drawings, in which:


REFERENCES:
patent: 5615998 (1997-04-01), Kodama et al.
patent: 5788566 (1998-08-01), McAnally et al.
patent: 5969941 (1999-10-01), Cho
patent: 6042474 (2000-03-01), Harvey et al.
patent: 6186889 (2001-02-01), Byrne
patent: 6244953 (2001-06-01), Dugan et al.
patent: 6373698 (2002-04-01), Christensen
patent: 6375440 (2002-04-01), Kosugi

Affiliated with

Also associated with

Rating

Heat-dissipating assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-dissipating assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-dissipating assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2991956