Fishing – trapping – and vermin destroying
Patent
1992-11-13
1994-08-30
Thomas, Tom
Fishing, trapping, and vermin destroying
437207, 437212, 437217, 437220, 437 8, H01L 2160
Patent
active
053428072
ABSTRACT:
On a semiconductor integrated circuit die, a semipermanent electrical connection is effected by the use of wirebond techniques, in which the parameters of the wirebond are controlled, so that less bonding force retains the leadwires to the bondpads than the attachment strength of the bondpads to the die. The wirebond techniques include attaching leadwires to bondpads on the die, using ultrasonic wedge bonding. The strength of the bond between the leadwires is significantly less than the attachment strength of the bondpads, preferably by a ratio which ensures that the bondpads are not lifted from the die when the leadwires are removed by breaking the bond between the leadwires and the bondpads. Subsequent to testing and burnin, the bond between the leadwires and the bondpads is severed. The die are then removed from the package body and the bondpads may then be attached by conventional means. The technique is useful in providing known good die.
REFERENCES:
patent: 4069453 (1978-01-01), Veenenpaal
patent: 4288841 (1981-09-01), Gogal
patent: 4324040 (1982-04-01), Gottlieb
patent: 4340860 (1982-07-01), Teeple, Jr.
patent: 4437718 (1984-03-01), Selinko
patent: 4554505 (1985-11-01), Zachry
patent: 4597617 (1986-07-01), Enochs
patent: 4675599 (1987-06-01), Jensen et al.
patent: 4683423 (1987-07-01), Morton
patent: 4683425 (1987-07-01), Tossutto et al.
patent: 4686468 (1987-08-01), Lee et al.
patent: 4725918 (1988-02-01), Bakker
patent: 4739257 (1988-04-01), Jenson et al.
patent: 4760335 (1988-07-01), Lindberg
patent: 4766371 (1988-08-01), Moriya
patent: 4779047 (1988-10-01), Solstad et al.
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4801561 (1989-01-01), Sankhagowit
patent: 4842662 (1989-06-01), Jacobi
patent: 4843313 (1989-06-01), Walton
patent: 4855672 (1989-08-01), Shreeve
patent: 4859614 (1989-08-01), Sugahara et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4932883 (1990-06-01), Hsia et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 4956605 (1990-09-01), Bickford et al.
patent: 4970460 (1990-11-01), Jensen et al.
patent: 4987365 (1991-01-01), Shreeve et al.
patent: 4996476 (1991-02-01), Balyasny et al.
patent: 5002895 (1991-03-01), LeParquier et al.
patent: 5008614 (1991-04-01), Shreeve et al.
patent: 5008617 (1991-04-01), Czubatys et al.
patent: 5023189 (1991-06-01), Bartlow
patent: 5086269 (1992-02-01), Nobi
patent: 5109320 (1992-04-01), Bourdelaise et al.
patent: 5173451 (1992-12-01), Kinsman
Cloud et al., "Known-Good Die: A Key to Cost-Effective MCMs," Electronic Packaging & Production, Sep., 1992.
"Known Good Die" Micron Semiconductor, Inc., Brochure 1992.
Military SRAM Die, Micron Military Products Data Book, 1992, pp. 61-614.
Farnworth Warren M.
Gochnour Derek J.
Kinsman Larry D.
Wood Alan G.
Micro)n Technology, Inc.
Pappas Lia M.
Picardat Kevin M.
Thomas Tom
LandOfFree
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