Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2000-11-27
2002-11-19
Niebling, John F. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S612000
Reexamination Certificate
active
06482679
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method for manufacturing an electronic component. In more detail, the present invention relates to an electronic component with a shield case for housing surface mounting components mounted on a substrate.
2. Description of the Related Art
Electronic components comprises an electronic component
60
with a shield case
65
for housing surface mounting components
64
as shown in FIG.
17
. The method for manufacturing the electronic component with such shield case includes the following procedures.
(1) Through-holes
62
are formed on a substrate (a mother substrate)
61
provided with a plurality of substrates
51
for mounting the components, and a shield case attachment electrode
63
is formed on an inner circumference face (side face) of each through hole
62
as shown in FIG.
18
.
(2) In the next step, the surface mounting components
64
are mounted on a sheet substrate (the mother substrate)
61
, and the surface mounting components
64
are soldered to land electrodes (not shown) of the sheet substrate
61
.
(3) Subsequently, a solder paste
67
is filled in the through hole
62
.
(4) Then, each engaging pin
66
of a plurality of the shield cases
65
is inserted into the respective through hole
62
filled with the solder paste
67
.
(5) Then, a plurality of the shield cases
65
are soldered to the substrate
61
by allowing the solder in the solder paste
67
to melt. The shield cases
65
are connected and fixed to the substrate
61
as shown in
FIG. 17
by soldering the engaging pin
66
to the fixing electrodes (shield case attachment electrodes)
63
in the through holes
62
.
(6) Finally, an individual electronic component
60
as shown in
FIG. 17
is obtained by cutting the sheet substrate
61
along the lines (cutting lines) A—A using a dicing machine.
However, the shield case has been soldered by inserting the engaging pins
66
of the shield case
65
into the through holes
62
after filling the through hole
62
with the solder paste
67
. Since the shield case is fixed by almost completely filling the solder in the through holes
62
, the solder layer is cut when the mother substrate is cut (diced) into pieces. As a result, it has been a problem that the planarity of the product is compromised due to flashes of the solder, product characteristics are deteriorated by adhesion of solder debris to the product, and cutting becomes insufficient due to loading of the solder on the cutting blade.
In addition, special solder filling equipment is needed for filling the solder paste
67
into the through hole
62
, and the amount of the consumed solder paste is increased, raising material cost.
SUMMARY OF THE INVENTION
Accordingly, the object of the present invention for solving the problems as hitherto described is to provide a method for enabling an electronic component with a shield case housing surface mounting components mounted on a substrate to be manufactured by eliminating the step for filling the solder paste into the engaging hole, a highly reliable electronic component with a shield case manufactured by the method described above.
According to the present invention, a method for manufacturing an electronic component with a shield case for housing surface mounting components mounted on a substrate, comprising the steps of: pre-treating for soldering by inserting engaging pins of the shield case into engaging holes of a mother substrate provided with a plurality of the engaging holes, case fixing electrodes for attaching a plurality of the shield cases are disposed on the inner surfaces of the engaging holes, while applying a solder paste on the circumference of the engaging holes, or on an area including the periphery of engaging holes and at least a part of each engaging holes, on an opposite surface to the component mounting surface covered with the shield case on the mother substrate; placing the mother substrate on which the shield case is mounted in a reflow furnace and soldering and fixing each engaging pin of the shield case to the case fixing electrode by reflow soldering; and cutting the mother substrate, on which each engaging pin of the shield case is soldered to respective case fixing electrodes, into respective areas on which each shield case is mounted to divide the mother substrate into individual electronic component with the shield case housing the surface mounting components.
The engaging pin of the shield case is inserted into the engaging hole of the mother substrate, and the engaging pin is soldered to the engaging hole by reflow soldering while the solder paste is coated on the circumference, as well as on the area including the circumference of the engaging hole and at least a part of the engaging hole, at the reverse face (the back face) to the component mounting face covered with the shield case on the mother substrate. Consequently, the molten solder reaches the inside of the engaging hole and permeates into the gap between the engaging pin of the shield case and the case fixing electrode in the engaging hole to connect and fix the engaging pin to the case fixing electrode with the solder. Accordingly, the shield case is securely attached to the substrate (the mother substrate) without requiring the solder paste to be filled in the engaging hole.
Since the solder is not filled in the engaging hole, but a little amount of the solder permeates into the engaging hole, the solder is seldom cut in the cutting step of the mother substrate. Therefore, troubles such as deterioration of flatness of the product due to burrs of the solder caused by cutting the solder, deterioration of characteristics of the product due to adhesion of solder debris to the product, and insufficient cutting due to loading of the solder on the cutting blade can be suppressed and prevented.
The phrase “coating a solder paste on the circumference of the engaging hole, or on the area including the periphery of each engaging hole and at least a part of each engaging hole” as used in the present invention is a concept meaning that the solder paste is coated either only on the circumference of the engaging hole, or the solder paste is coated not only the circumference of the solder paste, but is also coated on the area including (covering) at least a part of the engaging hole in plane view. The method for coating the solder paste is not particularly limited in the present invention, but various method such as screen printing method, or a method for coating in a given pattern using a metal mask can be used.
Preferably, the inner side surface of the engaging pin comes into close contact with the inner circumference face of the engaging hole of the mother substrate when the engaging pin is inserted into the engaging hole on the mother substrate.
The inner side face of the engaging pin comes into close contact with the inner circumference face of the engaging hole of the mother substrate when the engaging pin is inserted into the engaging hole on the mother substrate. Therefore, the molten solder is easily permeate into the gap, because of capillary phenomena, between the inner circumference face of the engaging pin and the case fixing electrode, thereby reliability of attachment of the case is improved.
Preferably, the step for pre-treatment for soldering comprises: (a) coating the solder paste on a connection land electrode to which the surface mounting components mounted on the component mounting surface of the mother substrate is electrically and mechanically connected; (b) coating the solder paste on the circumference of the engaging hole, or on the area including the periphery of the engaging hole and at least a part of the engaging hole, on the opposite surface of the mother substrate; (c) mounting the surface mounting component on the connection land electrode via the solder paste coated on the component mounting surface of the mother substrate; and (d) mounting the shield case on the mother substrate by inserting each engaging pins of the shield case into respective
Kato Tatsuya
Kitade Kazuhiko
Takamori Ryugaku
Yokoyama Yasuo
Lattin Christopher
Murata Manufacturing Co. Ltd.
Niebling John F.
Ostrolenk Faber Gerb & Soffen, LLP
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