Semiconductor module

Details Semiconductor module Semiconductor module

2000-03-10

2002-12-24

Cuneo, Kamand (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S772000, C361S774000, C361S777000, C361S779000, C257S696000, C257S773000, C257S775000, C257S779000

Reexamination Certificate

active

06498308

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to a semiconductor module, and more particularly, the present invention relates to a pattern shape for a contacting portion formed on a printed wiring board.
This application is a counterpart of Japanese application Serial Number 096414/1999, filed Apr. 2, 1999, the subject matter of which is incorporated herein by reference.
2. Description of the Related Art
FIG. 3
is a schematic diagram showing a semiconductor module of a conventional art.
As shown in
FIG. 3
, a plurality of surface mounting type semiconductor packages
101
(e.g. T-SOP (Thin-small Outline Package) is mounted on a memory module. Concretely, for forming an electric circuit, the plurality of surface mounting type semiconductor packages
101
are formed on a printed wiring board
102
(e.g. a glass epoxy resin substrate, or a ceramic substrate). The printed wiring board
102
has a structure formed of a conductive pattern on an insulating material. For electrically connecting a module product with an external device (e.g. a personal computer), a plurality of external terminals
103
is formed on the printed wiring board
102
.
FIG. 4
is a cross-sectional view taken in the direction of the arrows substantially along the line a—a of FIG.
3
.
As shown in
FIG. 4
, the plurality of surface mounting type semiconductor packages
101
is made up of a semiconductor device
201
having an integrated circuit, a lead
2020
for transferring an electrical signal of the semiconductor device
201
to an external portion, a wiring
203
(e.g. the wiring made of a gold or aluminum) for transferring an electrical signal of the semiconductor device
201
to the lead
202
, a resin
204
(e.g. an epoxy resin, a silicon resin) for protecting the semiconductor device
201
and the wiring
203
from an external force, a printed wiring board
205
(e.g. a glass epoxy substrate, a ceramic substrate) formed of a conductive pattern, a pad
206
for transferring an electrical signal of the semiconductor device
201
formed on the printed wiring board
205
to the external portion, a conductive material
3
.g. a solder, a conductive resin, an Ag paste) electrically connecting the lead
202
with the pad
206
. The plurality of surface mounting type semiconductor packages
101
constructed as mentioned above is mounted on an upper surface and a lower surface of the printed wiring board
205
.
FIG. 5
is an enlarged plane view of b portion in FIG.
3
. As shown in
FIG. 5
, a pad
302
formed on a printed wiring board
301
has a width wider than a lead
304
.
FIG. 6
is a cross-sectional view taken in the direction of the arrows substantially along the line c—c of FIG.
3
.
As shown in
FIG. 6
, a lead
403
for the plurality of surface mounting type semiconductor packages
101
is electrically connected to a pad
402
formed on a printed wiring board
401
via a conductive material. The pad
402
is set to a width wider than a lead
403
.
In the conventional art, it is desired to avoid inferior connections caused by cracks between the lead and the pad.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a semiconductor module that can avoid inferior connections caused by cracks between the lead and the pad.
According to one aspect of the present invention, for achieving the above object, there is provided a semiconductor module comprising a chip formed with an integrated circuit, a first external connecting terminal electrically connected to the integrated circuit, a printed wiring board having a second external connecting terminal; and a conductive material electrically connecting the first external connecting terminal with the second external connecting terminal, wherein the conductive material is formed so as to cover a sidewall of the second external connecting terminal.


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