Multi-layer composite electronic component

Details Multi-layer composite electronic component Multi-layer composite electronic component

2000-08-23

2002-06-25

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Plural channel systems

Having branched circuits

C333S185000

Reexamination Certificate

active

06411178

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to multi-layer composite electronic components such as multi-layer duplexers, multi-layer triplexers, multi-layer diplexers, and multi-layer filter arrays, which are constructed for use in microwave bands.
2. Description of the Related Art
A conventional multi-layer composite electronic component has a structure shown in each of
FIGS. 9 and 10
. As shown in
FIG. 9
, a multi-layer composite electronic component
1
includes a ceramic sheet
6
having inductor patterns
12
to
17
disposed thereon, a ceramic sheet
7
having capacitor patterns
18
to
23
disposed thereon, a ceramic sheet
5
having coupling capacitor patterns
24
to
27
disposed thereon, a ceramic sheet
3
having shield patterns
28
a
and
29
a
disposed thereon, and a ceramic sheet
9
having shield patterns
28
b
and
29
b
disposed thereon.
On the left-half region of the duplexer
1
, a three-stage band pass filter circuit BPF
1
including LC resonators Q
1
to Q
3
, is provided. On the right-half region of the duplexer
1
, a three-stage band pass filter circuit BPF
2
including LC resonators Q
4
to Q
6
, is provided. Inductors L
1
to L
6
of the LC resonators Q
1
to Q
6
are defined by inductor patterns
12
,
13
,
14
,
15
,
16
, and
17
. Capacitors C
1
to C
6
of the LC resonators Q
1
to Q
6
are defined by capacitor patterns
18
,
19
,
20
,
21
,
22
,
23
and the top-end portions of the inductor patterns
12
,
13
,
14
,
15
,
16
, and
17
opposing the capacitor patterns
18
to
23
.
In addition, the LC resonators Q
1
to Q
3
of the band pass filter circuit BPF
1
are electrically coupled by coupling capacitors Cs
1
and Cs
2
defined by the inductor patterns
12
to
14
and coupling capacitor patterns
24
and
25
opposing the inductor patterns
12
to
14
. Shield patterns
28
a
and
28
b
are provided with the patterns
12
to
14
,
18
to
20
,
24
, and
25
, disposed therebetween. Similarly, the LC resonators Q
4
to Q
6
of the band pass filter circuit BPF
2
are electrically coupled by coupling capacitors Cs
3
and Cs
4
defined by the inductor patterns
15
to
17
and coupling capacitor patterns
26
and
27
opposing the inductor patterns
15
to
17
. Furthermore, shield patterns
29
a
and
29
b
are arranged with the patterns
15
to
17
,
21
to
23
,
26
, and
27
disposed therebetween.
As shown in
FIG. 10
, a multi-layer body
35
formed by laminating ceramic sheets
2
to
9
includes a transmission terminal electrode Tx, a reception terminal electrode Rx, an antenna: terminal electrode ANT, and ground terminal electrodes G
1
to G
4
. The transmission terminal electrode Tx is connected to the inductor pattern
12
of the LC resonator Q
1
, the reception terminal electrode Rx is connected to the inductor pattern
17
of the LC resonator Q
6
, and the antenna terminal electrode ANT is connected to the inductor patterns
14
and
15
of the LC resonators Q
3
and Q
4
, respectively. The ground terminal electrodes G
1
and G
2
are connected to one end of each of the inductor patterns
12
to
14
and one end of each of the capacitor patterns
18
to
20
of the LC resonators Q
1
to Q
3
. The ground electrodes G
3
and G
4
are connected to one end of each of the inductor patterns
15
to
17
and one end of the capacitor patterns
21
to
23
of the LC resonators Q
4
to Q
6
.
Meanwhile, in the conventional duplexer
1
, the inductor patterns
12
to
14
constituting the band pass filter circuit BPF
1
and the inductor patterns
15
to
17
constituting the band pass filter circuit BPF
2
are arranged parallel to each other on the same plane of the ceramic sheet
6
. With this arrangement, magnetic field components generated on the inductor patterns
12
to
14
and magnetic field components generated on the inductor patterns
15
to
17
are also parallel to each other. As a result, the band pass filter circuits BPFs
1
and
2
tend to be electrically coupled with each other, thereby leading to changes in the filter characteristics of the band pass filter circuits BPFs
1
and
2
.
In order to prevent the above problems, it is necessary to increase the space between the band pass filter circuits BPFs
1
and
2
, or it is necessary to dispose a shield pattern between the band pass filter circuits BPFs
1
and
2
. However, such measures are not effective enough to reduce the electric coupling between the band pass filter circuits BPFs
1
and
2
, and another problem such as an increase in the size of the duplexer
1
is caused due to the extra space or the shield pattern.
SUMMARY OF THE INVENTION
To overcome the problems described above, preferred embodiments of the present invention provide a compact multi-layer composite electronic component in which electric couplings between a plurality of high-frequency circuits contain ed therein are greatly reduced.
To this end, according to one preferred embodiment of the present invention, there is provided a multi-layer composite electronic component including (1) a multi-layer body defined by laminating a plurality of insulating layers, a plurality of inductor conductors, and a plurality of capacitor conductors, (2) a first high-frequency circuit having a plurality of LC resonators including a plurality of inductors defined by the inductor conductors and a plurality of capacitors defined by the capacitor conductors, and (3) a second high-frequency circuit having a plurality of LC resonators including a plurality of inductors defined by the inductor conductors and a plurality of capacitors defined by the capacitor conductors. In this multi-layer composite electronic component, at least one of the inductors of the first high-frequency circuit is disposed substantially perpendicularly to at least one of the inductors of the second high-frequency circuit.
Since at least one of the inductors of the first high-frequency circuit is arranged substantially perpendicularly to at least one of the inductors of the second high-frequency circuit, the magnetic-field components generated around each of the inductors are also substantially perpendicular to each other. As a result, the electric couplings between the inductors are minimized.
Other features, elements, characteristics and advantages of present invention will become apparent from the following detailed description of preferred embodiments thereof with reference to the attached drawings.


REFERENCES:
patent: 5777533 (1998-07-01), Kato et al.
patent: 5783976 (1998-07-01), Furutani et al.
patent: 5880649 (1999-03-01), Tai et al.

Affiliated with

Also associated with

Rating

Multi-layer composite electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer composite electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer composite electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2978554