Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-12-28
2002-11-05
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S699000, C257S714000, C257S715000, C174S015100, C174S015200, C174S016300, C165S080400, C165S104260
Reexamination Certificate
active
06477045
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat dissipater, and more particularly to a heat dissipater that is adapted to be mounted on a CPU (Central Processing Unit) and includes a chamber corresponding to a cooling fan and containing liquid to promote the dissipation of heat.
2. Description of Related Art
The working temperature of CPUs corresponds to the frequency of the CPU. A high frequency causes a high working temperature. However, a high working temperature damages the electrical and electronic elements of the computer that contain the CPU. Consequently, a heat dissipater for a central processing unit is marketed.
With reference to
FIG. 11
, a conventional heat dissipater for a central processing unit in accordance with the prior art comprises a plate (
60
) and multiple fins (
62
). The plate (
60
) has a first side adapted to abut a heat source (
70
), such as a CPU, and a second side having multiple parallel heat dissipating fins (
62
) extending upward from the second side of the plate (
60
). A cooling fan (
80
) is attached to the top of the dissipating fins (
62
) to promote the dissipation of heat.
However, new CPUs, such as the Pentium 4 manufactured by Intel, operate at a frequency greater than one giga-hertz so that the conventional heat dissipater needs to be altered to dissipate the heat generated by high-frequency CPUs.
The present invention has arisen to mitigate and/or obviate the disadvantages of the conventional heat dissipater for a central processing unit.
SUMMARY OF THE INVENTION
The main objective of the present invention is to provide an improved heat dissipater for a CPU capable of dissipating much more heat with a device fundamentally the same size as the conventional device.
To achieve the main objective, the heat dissipater for a CPU in accordance with the present invention comprises an upper block and a lower block abutting each other. The upper block has a series of fins extending upward from a first side of the upper block and a recess defined in a second side of the upper block. The lower block includes a first side having a recess defined to correspond to the recess in the upper block and forming a closed chamber with the recess in the upper block and a second side adapted to abut the CPU. Volatile liquid fills the close chamber to promote the dissipation of heat by the heat dissipater for a CPU.
Further benefits and advantages of the present invention will become apparent after a careful reading of the detailed description with appropriate reference to the accompanying drawings.
REFERENCES:
patent: 5697428 (1997-12-01), Akachi
patent: 5763951 (1998-06-01), Hamilton et al.
patent: 5835345 (1998-11-01), Staskus et al.
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 6019165 (2000-02-01), Batchelder
patent: 6269866 (2001-08-01), Yamamoto et al.
patent: 6324058 (2001-11-01), Hsiao
patent: 6373702 (2002-04-01), Oishi et al.
patent: 6388317 (2002-05-01), Reese
Chao Fei-Fei
Chervinsky Boris
Venable Baetjer Howard & Civiletti LLP
Wang Tien-Lai
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