Cooling system for electronic device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S080300, C312S236000, C454S184000

Reexamination Certificate

active

06487074

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a cooling system for electronic devices such as a note-type personal computer, a desk top-type computer or the like.
RELATED ART
In general, various cooling systems have been introduced to cool heat generated from heat generating components such as a CUP or the like in electronic devices.
FIG. 5
is a schematic cross-sectional view of a conventional cooling system for electronic devices. As shown in
FIG. 5
, the conventional cooling system for electronic devices includes a heat pipe
52
thermally connected to a heat generating component
51
such as a CPU or the like installed within a case
50
, and a heat sink having pin-type fin
53
which is thermally connected to the heat pipe
52
. A fan
56
is attached to the heat sink
54
in the vicinity of outlet port
55
of the case
50
.
According to the conventional cooling system for electronic devices, the heat generated from the heat generating component
51
is transferred through the heat pipe
52
to the heat sink
54
, and then, exhaled through the outlet port
55
by means of the rotation of the fan
56
.
SUMMARY OF THE INVENTION
The present invention relates to a cooling system for an electronic device in which a highly cooling effect can be obtained even if the space within the case is small. One embodiment of a cooling system for an electronic device of the present invention comprises a cooling system for an electronic device including a heat generating component within a case, wherein said heat generating component is installed on a bottom plate of said case, said bottom plate is made of a heat transfer material with a ventilating hole for air passage formed therein, and a foot portion installed outer surface of said case for maintaining a prescribed vertically opened space below the lower surface of the case.


REFERENCES:
patent: 5339214 (1994-08-01), Nelson
patent: 5414591 (1995-05-01), Kimura et al.
patent: 5813243 (1998-09-01), Johnson et al.
patent: 5875965 (1999-03-01), Lee
patent: 5934368 (1999-08-01), Tanaka et al.
patent: 6011689 (2000-01-01), Wrycraft
patent: 6094347 (2000-07-01), Bhatia
patent: 6141214 (2000-10-01), Ahn
patent: 6278607 (2001-08-01), Moore et al.
patent: 2000-277957 (2000-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Cooling system for electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling system for electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling system for electronic device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2955631

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.