Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1989-08-03
1991-02-26
Nimmo, Morris H.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
29849, 29852, 174261, 174266, H05K 100, H05K 310
Patent
active
049963910
ABSTRACT:
A printed circuit board includes an injected molded substrate having a pattern recessed in the substance surface of interconnect traces, through-connections and connecting rods. A trench-shaped depression is provided in the substrate surface in the region of each interconnect trace, and a planar depression is provided in the substrate's surface in at least one of (a) the region of each through-connection and (b) the region of each contact surfacae. The pattern of recesses is covered with a conductive metal coat, and the depth of each planar depression is greater than the depth of each trench-shaped depression, so that the metal coat fills the trench-shaped depressions to the surface of the substrate, while in the planar depressions a distance remains between the metal coat and the surface of the substrate. A solder stop lacquer can then be applied such as by roller coating, without the necessity of photo-structuring and without filling the planar depressions.
REFERENCES:
patent: 4363930 (1982-12-01), Hoffman
patent: 4374457 (1983-02-01), Wiech, Jr.
patent: 4402135 (1983-09-01), Schweingruber et al.
patent: 4510347 (1985-04-01), Wiech, Jr.
patent: 4532152 (1985-07-01), Elarde
patent: 4604799 (1986-08-01), Gurol
Nimmo Morris H.
Siemens Aktiengesellschaft
LandOfFree
Printed circuit board having an injection molded substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board having an injection molded substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board having an injection molded substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-295105