Sputtering apparatus with a rotating magnet array having a geome

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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C23C 1435

Patent

active

049959581

ABSTRACT:
A magnetron sputtering apparatus includes a rotatable magnet. At least a portion of the centerline of the magnet lies on a curve defined by ##EQU1## where .xi.(u) is a preselected erosion profile. When stationary, the magnet generates a localized magnetic field of approximately constant width. In operation, when the magnet is rotated, it generates the preselected erosion profile in the target. The preselected erosion profile may be constant.

REFERENCES:
patent: 4444643 (1984-04-01), Garrett
patent: 4872964 (1989-10-01), Suzuki et al.

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