Adsorption-type cooling apparatus

Refrigeration – Refrigeration producer – Sorbent type

Reexamination Certificate

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Details

C062S476000

Reexamination Certificate

active

06474099

ABSTRACT:

CROSS REFERENCE TO RELATED ART
The present invention is related to Japanese patent application No. Hei. 11-359761, filed Dec. 17, 1999; 2000-56055, filed Feb. 28, 2000; the contents of which are incorporated herein by reference.
FIELD OF THE INVENTION
The present invention relates to an adsorption-type cooling apparatus, and more particularly to an adsorption-type cooling apparatus that is suitable for application to air conditioners.
BACKGROUND OF THE INVENTION
The assignee has filed an application relating to an adsorption-type cooling apparatus containing at least four adsorption devices (Laid-open Japanese Patent Application 9-303900 hereby incorporated by reference). However, in the above-mentioned openly described invention, the apparatus is difficult to control.
SUMMARY OF THE INVENTION
In view of the above, the present invention provides an adsorption-type cooling apparatus containing four adsorption devices. The present invention provides an adsorption-type cooling apparatus comprising first, second, third, and fourth adsorption devices. These devices are filled with a coolant and contain adsorbents which adsorb evaporated coolant and desorb the adsorbed coolant during heating. Adsorption cores provide heat exchange between the adsorbents and a heat medium, and evaporation and condensation cores provide heat exchange between heating medium and the coolant. A cooling device in which heating medium cooled in the evaporation and condensation cores circulates and cools the object of cooling. A heating means supplies a high-temperature heat medium to the first-fourth adsorption devices. A cooling means supplies a low-temperature heat medium which has a temperature lower than that of the high-temperature heat medium to the first-fourth adsorption devices. Also, a switching control means is provided which switches between multiple states. In a first state, a heat medium is circulated between the cooling device and evaporation and condensation cores of the first and second adsorption devices. The low-temperature heat medium is circulated to the adsorption core of the first adsorption device and heating medium exiting the cooling device is circulated to the adsorption core of the second adsorption device. Meanwhile, the high-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption devices and the low-temperature heat medium is circulated to the evaporation and condensation cores of the third and fourth adsorption devices. In a second state, a heat medium is circulated between the cooling device and evaporation and condensation cores of the first and second adsorption devices and the low-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices. Meanwhile the high-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption devices and the low-temperature heat medium is circulated to the evaporation and condensation cores of the third and fourth adsorption devices. In a third state, the low-temperature heat medium is supplied to the inlet openings of evaporation and condensation cores of the first and second adsorption devices and the high-temperature heat medium is supplied to inlet openings of the adsorption cores of the first and second adsorption devices. Meanwhile, the low-temperature heat medium is supplied to the inlet openings of the adsorption cores of the third and fourth adsorption devices and heating medium exiting the cooling device is supplied to the evaporation and condensation cores of the third and fourth adsorption devices. In a fourth state, the low-temperature heat medium is circulated to the evaporation and condensation cores of the first and second adsorption devices and the high-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices. Meanwhile, the low-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption devices and when the evaporation and condensation cores of the third and fourth adsorption devices were filled with heating medium that exited the cooling device, the circulation of this heat medium is terminated. In a fifth state, a heat medium is circulated between the cooling device and evaporation and condensation cores of the third and fourth adsorption devices, the low-temperature heat medium is circulated to the adsorption core of the third adsorption device, and heating medium exiting the cooling device is circulated to the adsorption core of the fourth adsorption device. Meanwhile, the high-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices and the low-temperature heat medium is circulated to the evaporation and condensation cores of the first and second adsorption devices. In a sixth state (VI), a heat medium is circulated between the cooling device and evaporation and condensation cores of the third and fourth adsorption devices and the low-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption device. Meanwhile, the high-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices and the low-temperature heat medium is circulated to the evaporation and condensation cores of the first and second adsorption devices. In a seventh state (VII), the low-temperature heat medium is supplied to evaporation and condensation cores of the third and fourth adsorption devices and the high-temperature heat medium is supplied to the inlet openings of adsorption cores of the third and fourth adsorption device. Meanwhile, low-temperature heat medium is supplied to the inlet openings of the adsorption cores of the first and second adsorption devices and heating medium exiting the cooling device is supplied to the evaporation and condensation cores of the first and second adsorption devices. In an eighth state (VIII), the low-temperature heat medium is circulated to the evaporation and condensation cores of the third and fourth adsorption devices and the high-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption device. Meanwhile, the low-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices and when the evaporation and condensation cores of the first and second adsorption devices were filled with heating medium, exiting the cooling device, circulation of this heat medium is terminated. Accordingly, the switching control means has a first switching control pattern in which the states are switched in the following order: first state (I)→second state (II)→third state (III)→fourth state (IV)→fifth state (V)→sixth state (VI)→seventh state (VII)→eighth state (VIII)→first state (I).
As a result, heating medium flowing out of the cooling device which was cooling the adsorption cores in the first and fifth states is supplied to the evaporation and condensation cores undergoing the adsorption process, without being supplied to the adsorption cores, in the second and sixth states. For this reason, the supply of heating medium that has been heated while cooling the adsorption cores to the evaporation and condensation cores undergoing the adsorption process in the next stage can be prevented. Therefore, heating of the evaporation and condensation cores undergoing the adsorption process in the next stage can be prevented in advance. As a result, it is possible to prevent the loss of cooling capacity of the adsorption-type cooling apparatus. Also, the outflow temperature fluctuation is reduced by two-stage adsorption devices. Moreover, water hammering is prevented by switching valves.
In another aspect, the switching control means has a second switching control pattern in which the states are switched in the following order: fourth state (IV)→seventh state (VII)→eighth state (VIII)→third state (III)→fourth state (IV).
As a result, if the second control pattern is implemented

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