Plating on metallic substrates

Details Plating on metallic substrates Plating on metallic substrates

1989-04-03

1990-10-02

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

204 29, 204 40, C25D 538, C25D 510

Patent

active

049604937

ABSTRACT:
A metal such as copper is deposited as a layer upon a substrate such as molybdenum by cleaning the substrate, etching the substrate to remove gross oxides thereupon, treating the substrate in a concentrated acid, such as hydrochloric acid, with the substrate made cathodic, depositing a metal strike layer, such as nickel or gold, on the substrate, and depositing the metallic layer overlying the strike layer. The cathodic treatment in the concentrated acid permits deposition of the strike layer before the oxide layer reforms.

REFERENCES:
patent: 4137131 (1979-01-01), Donaghy
patent: 4212907 (1980-07-01), Wright
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., NY, 1978, pp. 80-83, 224.
H. Silman et al., Protective and Decorative Coatings for Metals, Finishing Publications, Ltd., Teddington, Middlesex, England, 1978, pp. 124-127.

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