Layout for a ball grid array

Details Layout for a ball grid array Layout for a ball grid array

1999-10-06

2002-04-16

Loke, Steven (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S773000, C257S737000, C257S738000, C257S772000, C257S779000, C257S780000, C257S784000, C361S777000

Reexamination Certificate

active

06373139

ABSTRACT:

TECHNICAL FIELD
This invention relates in general to electrical devices, and more particularly, to a layout for a ball grid array device.
BACKGROUND
Because every solder ball pad on a surface mounted ball grid array (BGA) device needs an interconnection via, present layout techniques require routing around or using another printed circuit board (PCB) layer to route a signal trace from one side of a BGA package to the other. This present layout technique makes interconnection of BGA packages and surrounding components difficult.
Referring to
FIG. 1
, there is shown a BGA package
100
having a solder ball pad and interconnection via layout in accordance with the prior art. Multi-layer PCB's such as BGA package
100
are designed with horizontal (X-axis) and vertical (Y-axis) layers. Pads
102
, the top pads, are designed to receive the solder balls for the BGA package, while interconnection vias
104
interconnect a specific solder ball pad
102
through the different PCB layers in the BGA package
100
.
As shown in
FIG. 1
, the interconnection vias
104
are all set at the same 45° angle to the solder ball pads
102
.
FIGS. 2-4
show some of the inner PCB layers
200
,
300
,
400
and highlight the typical interconnect traces used with the prior art BGA package
100
. As shown, using the same 45° angle for all of the interconnection vias
104
does not leave much room in the inner layers
200
,
300
and
400
for routing traces. A need thus exists for a BGA package layout that helps improve the ability to route traces and may also help decrease the BGA board area and/or number of layers needed for the layout.


REFERENCES:
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5784262 (1998-07-01), Sherman

Affiliated with

Also associated with

Rating

Layout for a ball grid array does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Layout for a ball grid array, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Layout for a ball grid array will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2892938