Electronic assembly and cooling thereof

Details Electronic assembly and cooling thereof Electronic assembly and cooling thereof

2000-09-13

2002-04-23

Picard, Leo P. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S694000, C361S695000, C361S696000, C361S699000, C257S714000, C174S015100, C174S016100, C165S080200, C165S080400, C165S104330, C165S185000

Reexamination Certificate

active

06377457

ABSTRACT:

BACKGROUND OF THE INVENTION
1). Field of the Invention
This invention relates to an electronic assembly and cooling thereof.
2).
Discussion of Related Art
Integrated electronic circuits are often formed in semiconductor dies. Such a die is mounted and electrically connected to a package substrate which is then mounted to an electronic substrate such as a motherboard. The package substrate is also electrically connected to the motherboard. Electric signals can be transmitted between metal lines in the motherboard and the electronic circuit so that the electronic circuit is operated.
Operation of the electronic circuit causes heating of the semiconductor die. The electronic circuit may be damaged when the die heats up too much and it may therefore be required to cool the die. The die is typically cooled by mounting a heat sink to the die. Heat can then be transferred from the die to the heat sink and be convected from fins of the heat sink. Alternatively, a fan may be mounted over the die and the fan may blow air onto the die so as to cool the die. A heat sink or a fan increases transfer of heat from a surface of the die opposing the package substrate and the motherboard.


REFERENCES:
patent: 4519447 (1985-05-01), Wiech, Jr.
patent: 4631636 (1986-12-01), Andrews
patent: 4758926 (1988-07-01), Herrell et al.
patent: 4809058 (1989-02-01), Funamoto et al.
patent: 4852645 (1989-08-01), Coulon et al.
patent: 5313361 (1994-05-01), Martin
patent: 5692558 (1997-12-01), Hamilton et al.
patent: 5737186 (1998-04-01), Fuesser et al.
patent: 5763951 (1998-06-01), Hamilton et al.
patent: 5870823 (1999-02-01), Bezama et al.

Affiliated with

Also associated with

Rating

Electronic assembly and cooling thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic assembly and cooling thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic assembly and cooling thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2874439