Thermal transfer material and thermal transfer recording method

Details Thermal transfer material and thermal transfer recording method Thermal transfer material and thermal transfer recording method

1993-09-02

1995-02-14

Simmons, David A.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

428195, 428484, 4284881, 4284884, 428522, 428913, 428914, B41M 500

Patent

active

053894294

ABSTRACT:
A thermal transfer material including a support and a heat-transferable ink layer disposed thereon, wherein the heat-transferable ink layer has a storage elasticity modulus E' satisfying a relationship of: 1.times.10.sup.7 .ltoreq.E'.ltoreq.1.times.10.sup.9 N/m.sup.2 at 30.degree. C.; and the temperature providing a thermal differential value of dynamic energy loss angle (tan .delta.) satisfying a relationship of d(tan .delta.)/dT=1.times.10.sup.-2 is in the range of 40.degree. to 60.degree. C.

REFERENCES:
patent: 3368989 (1966-02-01), Wissinger et al.
patent: 3982940 (1976-09-01), Kinjo et al.
patent: 4564534 (1986-01-01), Kushida et al.
patent: 4624891 (1986-11-01), Sato et al.
patent: 4681796 (1987-07-01), Maehashi et al.
patent: 4743920 (1988-05-01), Tohma et al.
patent: 4880324 (1989-11-01), Sato et al.
patent: 4880686 (1989-11-01), Yaegashi et al.
patent: 4882593 (1989-11-01), Touma et al.
patent: 4935306 (1990-06-01), Ohtsuka et al.
patent: 4948446 (1990-08-01), Yamahata et al.
patent: 4960632 (1990-10-01), Tohma et al.
patent: 5008683 (1991-04-01), Suzuki
patent: 5049903 (1991-09-01), Suzuki
patent: 5120383 (1992-06-01), Takei et al.
patent: 5147707 (1992-09-01), Hasegawa et al.
patent: 5268052 (1993-12-01), Takizawa et al.
patent: 5334574 (1994-08-01), Matsuda et al.
Off. Search Report for Eur. Pat. Appln. No. 90107864.2.

Affiliated with

Also associated with

Rating

Thermal transfer material and thermal transfer recording method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal transfer material and thermal transfer recording method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal transfer material and thermal transfer recording method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-286377