Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1999-03-12
2002-04-09
Paladini, Albert W. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C361S785000, C361S786000, C361S789000, C439S060000
Reexamination Certificate
active
06369336
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to printed circuit boards and more particularly to printed circuit boards having conductive pads formed on upper and lower surfaces near an edge of a board main body that make electrical connection with sliding electrical contacts.
BACKGROUND OF THE INVENTION
An example of a printed circuit board of this type is shown in
FIG. 5
as disclosed in Japanese Patent Disclosure No. 96-241755. Printed circuit board
100
comprises a board main body
101
having multiple conductive pads
102
formed on upper and lower surfaces of the main body. The conductive pads
102
are arranged in one row on both surfaces of the board main body
101
along and near edge
103
of the main body.
On the other hand, housing
111
of card edge connector
110
has a board-receiving slot
112
to accommodate the printed circuit board
100
inside of which multiple electrical contacts
113
are arranged in two mutually-opposed rows. When the printed circuit board
100
is inserted in the board-receiving slot
112
, the contacts
113
make sliding electrical connection with respective conductive pads
102
arranged on the upper and lower surfaces of the printed circuit board
101
. Latch-ejection members
114
, the purpose of which is to latch the printed circuit board
100
in the board-receiving slot
112
or to eject it therefrom, are pivotally mounted at the ends of housing
111
by pins
115
so that the latch-ejection members
114
operate in a pivotal manner relative to the housing
111
.
However, in some cases, the conductive pads
102
on the upper and lower surfaces of the printed circuit board
101
must be connected together by means of via holes when such pads are used as grounding pads. In such cases, the via holes are positioned near the ends of the conductive pads
102
, i.e., at the ends opposite to the edge
103
of the board main body
101
so that the via holes would not interfere with contacts
113
. The problem is that in such cases, the width of the conductive pads
102
must be increased in the direction of the gliding of the contacts
113
by a portion equal to at least the diameter of the via holes, thus making it necessary to increase the width of the printed circuit board
100
by the same amount.
Another problem is the fact that in the process of insertion of the printed circuit board
100
in the board-receiving slot
112
, the contacts
113
rub against the edge
103
of the printed circuit board
100
. As a result, a powdered substance is produced that may affect the electrical connections between the contacts
113
and the conductive pads
102
.
SUMMARY OF THE INVENTION
Therefore, the purpose of the present invention is to provide a printed circuit board with conductive pads formed on upper and lower surfaces of a board main body that has a smaller width in the direction of sliding engagement with electrical contacts and that makes it possible to establish a smooth electrical connection with the electrical contacts even if a powdered substance is produced.
The printed circuit board according to the present invention has conductive pads formed near an edge of the main body of the circuit board on upper and lower surfaces thereof so that the conductive pads establish electrical connections with electrical contacts as the contacts slide from the edge of the board main body inwardly, and by the fact that via holes establish electrical connection between conductive pads on the upper and lower surfaces of the main body of the circuit board and that such via holes are located in the paths of the contacts.
Contact members of the electrical contacts enraging the conductive pads have a curved or arcuate surface, the radius of which is greater than the radius of the via holes, thus providing for a better electrical connection.
REFERENCES:
patent: 3518612 (1970-06-01), Dunman et al.
patent: 3651432 (1972-03-01), Henschen et al.
patent: 08-241755 (1996-09-01), None
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