Dynamic magnetic information storage or retrieval – Head mounting – Disk record
Reexamination Certificate
2000-08-22
2002-05-14
Heinz, A. J. (Department: 2652)
Dynamic magnetic information storage or retrieval
Head mounting
Disk record
Reexamination Certificate
active
06388840
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a disc apparatus and, more particularly to a magnetic head slider supporting device which includes a suspension to support a magnetic head.
As frequencies of signals used by information processing apparatuses increased, it is required for a magnetic disc apparatus to increase a signal writing frequency, which is presently 70 MHz, up to 200 to 300 MHz. In order to increase the signal writing frequency, an inductance and a capacitance of a signal transmission path from a magnetic head slider to a head IC must be reduced. On the other hand, since a reduction in thickness of the magnetic disc apparatus is required, the head IC must be mounted at a position where the head IC does not contact a magnetic disc when a shock is applied to the magnetic disc apparatus. Additionally, in order to increase reliability of the magnetic disc apparatus, it is preferred to mount the head IC at a position where an equivalent mass of a magnetic head slider supporting device is not increased.
2. Description of the Related Art
Conventionally, Japanese Laid-Open Patent Applications No. 5-143949, 3-272015, No. 3-108120 and No. 3-25717 disclose magnetic disc apparatuses having a head IC mounted on an arm, the head IC being used for amplifying a read signal supplied from a head.
In the above-mentioned magnetic disc apparatuses, a distance between the head and the head IC is long. Thus, it is difficult to reduce an inductance and capacitance of a transmission path from the head to the head IC. Additionally, since the head IC is packaged by a synthetic resin and has a relatively large thickness, a large space must be provided between adjacent magnetic discs so that the head IC does not contact the magnetic discs when a shock is applied to the magnetic disc apparatus. Accordingly, thickness of the magnetic disc apparatus is increased. Further, since the head IC is packaged by a synthetic resin and has a relatively large weight, an equivalent mass of the magnetic head slider supporting device is increased. Thus, floating stability of a magnetic head slider with respect to a magnetic disc is decreased. Additionally, the magnetic disc may be damaged due to an increased shock when the magnetic head slider contacts the magnetic disc in a case in which a large shock is applied to the magnetic disc apparatus.
SUMMARY OF THE INVENTION
It is a general object of the present invention to provide an improved and useful head slider supporting device including a suspension in which the above-mentioned problems are eliminated.
A more specific object of the present invention is to provide a suspension on which a wiring pattern having a small inductance and a small capacitance can be formed without increasing an equivalent mass of the suspension.
Another object of the present invention is to provide a suspension to which a head IC chip can be mounted in a state where the mounted head IC chip is prevented from contacting surrounding parts.
In order to achieve the above-mentioned objects, there is provided according to one aspect of the present invention a suspension elastically supporting a head slider having a head, comprising:
a base portion adapted to be mounted to an arm driven by an actuator;
a head slider mounting portion adapted to support the head slider, the head slider mounting portion being formed on an end of the suspension opposite to the base portion;
a tongue portion formed along a side of the base portion, the tongue portion uprightly protruding from the base portion; and
a head IC chip mounting portion formed in the tongue portion, the head IC chip mounting portion adapted to support a head IC chip connected to the head.
According to the above-mentioned invention, the head IC chip is mounted on the tongue portion which protrudes uprightly from the base portion mounted to the arm. That is, the head IC chip is mounted to a position which does not influence an equivalent mass of the suspension. Thus, the suspension according to the present invention provides good floating stability to the head slider. Additionally, when a shock is applied to the disc apparatus using the suspension according to the present invention, the strength of the shock is not increased by the suspension which has a reduced mass as compared to the conventional suspension. Further, since the head IC chip is mounted to a side of the base portion, the head IC does not protrude from a surface of the suspension. Thus, the head IC chip does not contact a disc even when a strong shock is applied to the suspension.
The suspension according to the present invention may further comprises a wiring pattern extending from the head slider mounting portion to the tongue portion so as to electrically connect the head to the head IC chip.
Accordingly, a length of the wiring pattern can be minimized, and an inductance and a capacitance provided by the wiring pattern can be minimized. Thus, a frequency of a signal transmitted through the wiring pattern can be increased beyond 70 MHz and up to 200 to 300 MHz.
In one embodiment according to the present invention, the head may be a magnetic head. Additionally, the base portion may be made of a metal plate, and the tongue portion may be formed by bending the metal plate.
Additionally, there is provided according to another aspect of the present invention a suspension elastically supporting a head slider having a head, comprising:
a base portion adapted to be mounted to an arm driven by an actuator;
a head slider mounting portion adapted to support the head slider, the head slider mounting portion being formed on an end of the suspension opposite to the base portion;
a rigid portion located between the base portion and the head slider mounting portion, the rigid portion having a rib along each side of the rigid portion;
a wiring pattern extending from the head slider mounting portion to the base portion through the rigid portion, the wiring pattern being provided on a surface from which the rib is extended; and
a head IC chip mounting portion formed on the surface of the rigid portion from which the rib is extended, the head IC chip mounting portion adapted to support a head IC chip connected to the head.
According to this invention, since the head IC chip is mounted on the rigid portion, the head IC chip does not increase an equivalent mass of the suspension. Additionally, the head IC chip is connected to a middle portion of the wiring pattern extending from the head slider to the base portion of the suspension, and a length of the wiring pattern is not increased. Additionally, a length of the wiring pattern can be minimized, and an inductance and a capacitance provided by the wiring pattern can be minimized. Thus, a frequency of a signal transmitted through the wiring pattern can be increased beyond 70 MHz and up to 200 to 300 MHz.
In one embodiment according to the present invention, the rigid portion may be made of a metal plate, and each rib of the rigid portion may be formed by bending the metal plate.
Additionally, there is provided according to another aspect of the present invention a head slider supporting device comprising:
A) a suspension comprising:
a base portion adapted to be mounted to an arm driven by an actuator;
a head slider mounting portion formed on an end of the suspension opposite to the base portion;
a tongue portion formed along a side of the base portion, the tongue portion uprightly protruding from the base portion; and
a head IC chip mounting portion formed in the tongue portion;
B) a head slider mounted on the head slider mounting portion of the suspension, the head slider including a head; and
C) a head IC mounted on the head IC chip mounting portion of the tongue portion of the suspension so that the head IC is electrically connected to the head of the head slider.
According to the above-mentioned invention, the head IC chip is mounted on the tongue portion which uprightly protrudes from the base portion mounted to the arm. That is, the head IC chip is mounted to a position which does not influe
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