Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1993-11-10
1995-06-27
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429815, 156345, C23C 1434
Patent
active
054276705
ABSTRACT:
A device is set forth for the treatment of substrates at low temperature, which device is provided with a process chamber (1) in which a holder (2) is arranged which is provided with a support plate (3) having an upper side (4) on which a substrate (5) can be placed, and having a lower side (6) which forms a wall (7) of a cooling chamber (8). The cooling chamber (8) is provided with an inlet (9) comprising a feed opening (10) and an outlet (11, 12) comprising a drain opening (13) through which a cooling liquid can be passed into and from the cooling chamber (8). A first portion (23) of the wall (7) of the cooling chamber (8) formed by the lower side (6) of the support plate (3) projects further into the chamber (8) than does a second portion (20), while the first and the second portion (23, 20, respectively) merge fluently into one another. The drain opening (13) of the outlet (11, 12) of the cooling chamber (8) is positioned adjacent the second portion (20) of the wall (7). In such a device, a substrate (5) can be cooled in an efficient and homogeneous manner down to the temperature of, for example, liquid nitrogen.
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Baggerman Jacobus A. G.
Hack Ronnie A. A.
Van Voorst Vader Pieter J. Q.
Balconi-Lamica Michael J.
Miller Paul R.
Nguyen Nam
U.S. Philips Corporation
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