Semiconductor device package and method of making same

Details Semiconductor device package and method of making same Semiconductor device package and method of making same

1975-09-29

1978-01-03

Wojciechowicz, Edward J.

357 68, 357 69, 357 81, H01L 2348, H01L 3902, H01L 2302

Patent

active

040670414

ABSTRACT:
The specification discloses a semiconductor device package which includes a conductive heat sink support member which is bonded to a planar face of a ceramic body. A conductive pattern is formed on a second planar face of the ceramic body and includes at least two discrete pattern portions. A semiconductor switching device has at least first and second terminals on one side and a third terminal on the other side. The semiconductor switching device is bonded on the one side to the conductive pattern, with the first and second terminals contacting the two discrete portions of the conductive pattern. First and second conductive leads are bonded to the two discrete portions of the conductive pattern adjacent to the semiconductor switching device and extend outwardly from the ceramic body. A third conductive lead is bonded to the third terminal on the other side of the semiconductor device.

REFERENCES:
patent: 3763403 (1973-10-01), Lootens
patent: 3829598 (1974-08-01), Darnell
patent: 3864727 (1975-02-01), Schoberl
patent: 3967296 (1976-06-01), Intrator

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