Card shelf heat transfer system and method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S080300, C361S695000, C454S184000

Reexamination Certificate

active

06356444

ABSTRACT:

TECHNICAL FIELD OF THE INVENTION
This invention relates in general to the field of modular electronic systems, and particularly to a card shelf thermal energy transfer system and method.
BACKGROUND OF THE INVENTION
Modular electronic systems are generally configured as a card shelf to optimize space efficiency within a central office on other similar facility. Card shelves include individual plug-in electronic module cards having different functions that communicates across a backplane. The electronic cards may have different thicknesses depending upon the amount of electronic circuitry contained in each electronic card. The electronic cards may also have flanges on the top or bottom which fit into grooves in the card shelf for sliding the electronic cards into the card shelf and plugging the electronic cards into connectors located in the backplane of the card shelf.
The card shelf may also include an open or perforated top and bottom portion to allow thermal energy generated by the electronic cards during operation to escape the card shelf. Additionally, the card shelf may include a fan assembly for directing airflow through the card shelf to dissipate thermal energy generated by the electronic cards during operation.
Known card sleeves present certain drawbacks. For example, to maximize space within a card shelf, electronic cards are placed in close proximity to one another. As a result, dissipation of thermal energy generated by the electronic cards during operation may be difficult or inadequate to maintain proper operation of the electronic cards. The thermal energy generated by the electronic cards may cause a fire to ignite within the card shelf, thereby damaging one or more of the electronic cards. Additionally, electronic cards in close proximity to one another may result in cross coupling of electromagnetic interference between the cards.
Including fan assemblies in known card shelves also presents certain drawbacks. For example, a partially filled card shelf may cause airflow generated by the fan assembly to be directed around the electronic cards to areas of less resistance. Although dummy cards may be inserted into the card shelf to compensate for misdirected airflow, a variety of thicknesses of dummy cards must be maintained to replace removed electronic cards or fill open areas in the card shelf.
SUMMARY OF THE INVENTION
The present invention provides a card shelf thermal energy transfer system and method that addresses short comings of prior systems and methods. In particular, dividers are provided between electronic cards that improve passive and active thermal energy transfer within the card shelf.
According to one embodiment of the present invention, a card shelf includes a backplane and a plurality of slots each configured to receive an electronic card adapted for engagement with the backplane. A plurality of dividers are disposed between slots in the card shelf. Each divider is configured for high absorption of thermal energy generated by the electronic card.
According to another embodiment of the present invention, a method for transferring thermal energy from an electronic card in a card shelf includes providing a divider configured for high absorption of thermal energy adjacent to the electronic card in the card shelf. Thermal energy generated by the electronic card is absorbed in the divider and transferred away from the electronic card via the divider.
Technical advantages of the present invention include providing an improved method and system for passively transferring thermal energy generated by the electronic cards away from the electronic cards. In particular, the dividers are provided between the electronic cards to passively remove thermal energy generated by the electronic cards. The dividers may include a coated, roughened or suitable surface to improve heat absorption. Preferably, the dividers are coupled to a heatsink for efficiently transferring the thermal energy absorbed by the dividers away from the electronic cards.
Another technical advantage of the present invention includes providing a card shelf with reduced cross coupling of electromagnetic interference between the electronic cards. In particular, the dividers reduce cross talk and electromagnetic interference between each electronic card. As a result, data and other errors caused by such interference is reduced.
Still another technical advantage of the present invention includes improved airflow through a partially filled card shelf. In particular, the dividers improve airflow from a fan system through the card shelf by equalizing the airflow through each area of the card shelf.
Yet another technical advantage of the present invention includes providing a card shelf and method for preventing propagation of thermal failures throughout the card shelf. For example, a failure of an electronic card may cause a fire to ignite within the card shelf. The dividers which are disposed adjacent to each electronic card prevent propagation of the fire to an adjacent electronic card.
Other technical advantages of the present invention will be readily apparent to one skilled in the art from the following figures, descriptions and claims.


REFERENCES:
patent: 3192443 (1965-06-01), Schonfeld et al.
patent: 4339633 (1982-07-01), Ahmed
patent: 4454566 (1984-06-01), Coyne
patent: 4498119 (1985-02-01), Cronin
patent: 4631641 (1986-12-01), Brombal et al.
patent: 4821145 (1989-04-01), Corfits et al.
patent: 5185691 (1993-02-01), Korinsky
patent: 5343361 (1994-08-01), Rudy, Jr.
patent: 5412652 (1995-05-01), Lu
patent: 5467348 (1995-11-01), Fujii et al.
patent: 5838924 (1998-11-01), Anderson et al.
patent: 5892662 (1999-04-01), Verma
patent: 5940266 (1999-08-01), Hamilton
patent: 5986888 (1999-11-01), Amaro
patent: 5991163 (1999-11-01), Marconi et al.
patent: 298 13 443 (1999-01-01), None
patent: 0 580 412 (1994-01-01), None
patent: 08326481 (1996-12-01), None
patent: WO 97/01264 (1997-01-01), None
McDysan, David E., et al.,ATM Theory and Application. McGraw-Hill, Inc. ISBN 0-07-060362-6, pp. 365-385, 1994.
Erdengiz, Ali, “ATM Usage Policing and Traffic Shaping,” Communications System Design (Jan. 1997).
Dobrowski, George et al.,ATM User-Network Interface Specification, Version 3.1, The ATM Forum, Sep., 1994.
Cerent 454™ High Speed SONET/SDN Transport System, ALTS trade show, Las Vegas, Nevada on or about Dec., 1998.
“FLM 150 ADM LAN Extension Product Design Specification,” Revision 1.1, Internal Design Specification for Product, sheets 6/353-10/353 and 72/353-75/353, Product publicly released on or about Dec., 1998.
“Product Design Specification (PDS) for FLASH-192, Release 1,” Internal Design Specification for Product, pp. 1/916; 4-12/9161 315-320/916.
“InterNetworking Systems; AnyMedia® Access Products; AnyMedia Access System,” http://www.lucent.com/ins/products/anymedia.html, Printed Aug. 10, 2000.
“AnyMedia® Access System,” Lucent Technologies, Inc. Marketing Communications, Sep., 1999.
“The AnyMedia™ Access System Anything's Possible,” Lucent Technologies, Inc. Marketing Communications, 1997.
Photography of Northern Telecom Card, card dated Apr., 1998.
Held, G.,Understanding Data Communications, Fifth Edition, Sams Publishing. ISBN No. 0-672-30934-3, Chapter 14, pp. 419-431, 1996.
McCloghrie, K., et al., “Management Information Base for Network Management of TCP/IP-based internets: MIB-II,” SNMP Working Group, Mar., 1991.
“Draft New Recommendation 1.630 (ATM Protection Switching),” ITU Telecommunication Standardization Sector, COM 13-41-E, Sep., 1998.
Guérin, R., et al., “Equivalent Capacity and its Application to Bandwidth Allocation in High-Speed Networks,” IEEE Journal on Selected Areas in Communications, vol. 9, No. 7, pp. 968-981, Sep., 1991.
Gün, L., et al., “Bandwidth Management and Congestion Control Framework of the Broadband Network Architecture,” Computer Networks and ISDN Systems 26, Elsevier Science Publishers B.V., North-Holland, pp. 61-78, 1993.
“S/DMS TransportNode ‘OC-3 Express’—Cost-Effective SONET Transport for Low-Capacity Applications”, Northern Telecom Marketing Publica

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Card shelf heat transfer system and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Card shelf heat transfer system and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Card shelf heat transfer system and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2840800

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.