Clip for heat sink

Details Clip for heat sink Clip for heat sink

2000-07-10

2002-07-09

Tolin, Gerald (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C024S458000, C248S510000

Reexamination Certificate

active

06418025

ABSTRACT:

BACKGROUND
1. Field of the Invention
The present invention relates to a clip, and particularly to a clip for readily attaching a heat sink to an electronic device.
2. The Related Art
A heat sink is usually placed in contact with an electronic device package for dissipating heat from the electronic device package. Various clips have been used to attach a heat sink to an electronic device package.
FIG. 5
shows a conventional clip assembly
59
which attaches a heat sink
52
to a chipset
54
for dissipating heat from the chipset
54
. A pair of fixing holes
51
is formed in a motherboard
50
to which the chipset
54
is mounted. A heat sink
52
comprises a rectangular chassis
57
positioned on the chipset
54
and two fastening ears
58
each defining a fastening hole
53
extending from the rectangular chassis
57
. A clip assembly
59
is associated with each fastening ear
58
for securing the heat sink
52
to the motherboard
50
. The clip assembly
59
comprises a pin
56
having a tapered insertion end and a spring
55
fit over and encompassing the pin
56
. The insertion end of the pin
56
extends through the fastening hole
53
of the corresponding fastening ear
58
and engages with the corresponding fixing hole
51
of the motherboard
50
. However, this arrangement requires four parts, namely, two pins and two springs, to secure the heat sink
52
to the chipset
54
, which is costly and complicates the assembly process.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a clip for a heat sink which has a simple configuration.
Another object of the present invention is to provide a clip for a heat sink which readily attaches the heat sink to an electronic device.
To achieve the above-mentioned objects, a clip in accordance with the present invention for attaching a heat sink to an electronic device mounted on a circuit board includes a body and a handle extending from the body for facilitating operation of the clip. An arcuate spring tab extends from the body and elastically engages with the heat sink. A pair of cutouts is defined in opposite edges of the body for accommodating a thickness of the circuit board. A pair of elastically deformable barbs is formed at a distal end of the body for engaging with the circuit board to securely affix the heat sink thereto.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed embodiment of the present invention with attached drawings, in which:


REFERENCES:
patent: 3909883 (1975-10-01), Fegen
patent: 4710852 (1987-12-01), Keen
patent: 5818695 (1998-10-01), Olson

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