Heat dissipation assembly and method of assembling the same

Details Heat dissipation assembly and method of assembling the same Heat dissipation assembly and method of assembling the same

2000-12-20

2002-05-21

Tolin, Gerald (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C029S890035, C219S056220, C361S719000, C361S816000

Reexamination Certificate

active

06392888

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat dissipation assembly and method of assembling the same, and more particularly to a heat dissipation assembly forming a grounding mechanism and a method for firmly attaching a heat sink to a printed circuit board and a chip.
2. Related Art
Many computer electronic devices such as chips and central processing units (CPUs) generate large amounts of heat. Excessive heat can adversely affect the stability and operation of a computer. Heat generated by a chip must be quickly removed therefrom. This is conventionally done by attaching a heat sink to the chip. Various kinds of clips, pins and adhesive tapes are used to closely attach a heat sink to a chip.
FIG. 3
shows a conventional heat dissipation assembly for attaching a heat sink
300
to a chip
500
which is mounted on a printed circuit board (PCB)
400
. A heat sink
300
is attached to the chip
500
using pins
100
and springs
200
. But retaining force exerted by the springs
200
is generally insufficient to firmly secure the heat sink
300
to the chip
500
. This reduces the efficiency of heat removal.
In some systems, heat-conductive adhesive tape is used between a heat sink and a chip. But such tape is prone to age and lose stickiness. Thus the connection between the heat sink and the chip often becomes loose.
Furthermore, with the development of high-speed chips, generation of electromagnetic interference (EMI) is becoming an increasingly serious problem. Conventional heat dissipation assemblies do not address this problem.
Thus an improved heat dissipation assembly and a method of assembling the same which overcome the problems of the related art are desired.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a method for firmly attaching a heat sink to a printed circuit board (PCB) and a chip.
Another object of the present invention is to provide a heat dissipation assembly having a grounding mechanism for reducing electromagnetic interference (EMI).
To achieve the above objects, a heat dissipation assembly in accordance with the present invention comprises a PCB, a chip and a heat sink. The PCB comprises a grounding circuit, and four through apertures in the grounding circuit. The chip is mounted on the PCB, and is surrounded by the through apertures. The heat sink has four metal columns depending from a bottom surface of a base thereof, the columns corresponding to the four through apertures. A method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.


REFERENCES:
patent: 4544942 (1985-10-01), McCarthy
patent: 5241453 (1993-08-01), Bright et al.
patent: 5566052 (1996-10-01), Hughes
patent: 5699610 (1997-12-01), Shimada et al.
patent: 6061240 (2000-05-01), Butterbaugh et al.
patent: 6125038 (2000-09-01), Amaro et al.
patent: 6219239 (2001-04-01), Mellberg et al.
patent: 6278615 (2001-08-01), Brezina et al.

Affiliated with

Also associated with

Rating

Heat dissipation assembly and method of assembling the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation assembly and method of assembling the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation assembly and method of assembling the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2830024