Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer
Reexamination Certificate
2008-05-06
2008-05-06
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaged product
Including resin or synthetic polymer
C430S165000, C430S189000, C430S191000, C430S192000, C430S193000, C430S326000, C430S330000, C528S353000
Reexamination Certificate
active
07368205
ABSTRACT:
The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitive resin composition comprising a diazoquinone compound, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device:wherein, X is an organic group of 2 to 4 valences; Y is an organic group of 2 to 6 valences; R1is a hydroxyl group or —O—R3wherein m is an integer of 0 to 2; R2is a hydroxyl group, a carboxyl group, —O—R3or —COO—R3wherein n is an integer of 0 to 4; R3is an organic group having 1 to 15 carbon atoms;wherein, each of R4and R5is a divalent organic group; each of R6and R7is a monovalent organic group; n is an integer of 0 to 20.
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Banba Toshio
Hirano Takashi
Chu John S.
Smith Gambrell & Russell
Sumitomo Bakelite Co. Ltd.
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