Methods for forming head suspension assemblies

Details Methods for forming head suspension assemblies Methods for forming head suspension assemblies

2008-03-11

2008-03-11

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603030, C029S603100, C029S603160, C029S851000, C216S022000, C216S039000, C216S041000, C264S434000, C360S234500, C360S235800, C438S003000

Reexamination Certificate

active

07340823

ABSTRACT:
Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support membrane is provided, and the opening is filled with a resin material. The transfer film with the resin material therein is positioned over the silicon wafer so that at least a portion of the resin material is positioned adjacent to the spacer layer. The resin material is baked to form a glassy carbon material. The spacer layer is etched to form a trench in the silicon wafer adjacent to the glassy carbon material, and a slider is positioned on the glassy carbon material over the trench.

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