Shaped lead assembly for optoelectronic devices

Details Shaped lead assembly for optoelectronic devices Shaped lead assembly for optoelectronic devices

2008-03-18

2008-03-18

Sanghavi, Hemang (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S088000, C385S089000

Reexamination Certificate

active

07344319

ABSTRACT:
An optoelectronic package is attached to a printed circuit board, in which optoelectronic package has a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

REFERENCES:
patent: 6769818 (2004-08-01), Wu

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