Method of mounting components on a PCB

Details Method of mounting components on a PCB Method of mounting components on a PCB

2008-01-01

2008-01-01

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S840000

Reexamination Certificate

active

07313862

ABSTRACT:
A printed wiring board is disclosed. The printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land not covered with the resist. The board recognition mark is defined by an area of the conductive foil exposed from a resist opening having the same shape and size as the conductive foil.

REFERENCES:
patent: 5943217 (1999-08-01), Hashimoto
patent: 6201193 (2001-03-01), Hashimoto
patent: 6365841 (2002-04-01), Takigami
patent: 6955942 (2005-10-01), Kobayashi et al.
patent: 2003/0209815 (2003-11-01), Ito et al.
patent: 11-40907 (1999-02-01), None
patent: 11-135939 (1999-05-01), None
patent: 11-220247 (1999-08-01), None
patent: 2003-304098 (2003-10-01), None
patent: 3558511 (2004-05-01), None

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