Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-05-27
2008-05-27
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S613000, C257S738000, C257S778000, C228S180210, C228S180220
Reexamination Certificate
active
07378297
ABSTRACT:
A device and a method for bonding elements are described. A first solder ball is produced on a main surface of a first element. A second solder ball is produced on a main surface of a second element. Contact is provided between the first solder ball and the second solder ball. The first and second elements are bonded by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a first layer of non-conductive material and the second solder ball is laterally embedded in a second layer of non-conductive material, such that the upper part of the first solder ball and upper part of the second solder ball are not covered by the non-conductive material. A third solder volume is applied on one or both of the embedded first or second solder balls, prior to the bonding.
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Chambliss Alonzo
Interuniversitair Microelektronica Centrum (IMEC)
Knobbe Martens Olson & Bear LLP
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