Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-03-25
2008-03-25
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S715000, C257S718000, C257S719000, C165S080300, C165S185000
Reexamination Certificate
active
07349219
ABSTRACT:
A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.
REFERENCES:
patent: 5109318 (1992-04-01), Funari et al.
patent: 5815371 (1998-09-01), Jeffries et al.
patent: 5966287 (1999-10-01), Lofland et al.
patent: 6119765 (2000-09-01), Lee
patent: 6188576 (2001-02-01), Ali et al.
patent: 6233150 (2001-05-01), Lin et al.
patent: 6353538 (2002-03-01), Ali et al.
patent: 6535387 (2003-03-01), Summers et al.
patent: 6765797 (2004-07-01), Summers et al.
patent: 7215551 (2007-05-01), Wang et al.
patent: 7221569 (2007-05-01), Tsai
patent: 2003/0026076 (2003-02-01), Wei
patent: 2004/0156174 (2004-08-01), Rubenstein et al.
Ding Qiao-Li
Lai Cheng-Tien
Zhou Zhi-Yong
Chervinsky Boris
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Knapp Jeffrey T.
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