Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-07-08
2008-07-08
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S701000, C257S730000, C257SE23173, C361S306100, C361S306200, C361S306300, C361S308100, C361S310000, C361S321200
Reexamination Certificate
active
07397118
ABSTRACT:
A chip-type electronic component includes a ceramic chip body, an external electrode formed on the chip body, a conductive elastic resin film made of a mixture of metal powder and elastic resin and formed to cover the external electrode, and a metal plating film. The metal powder is exposed at an obverse surface of the conductive elastic resin film. The metal plating film is formed on the obverse surface of the conductive elastic resin film at which the metal powder is exposed.
REFERENCES:
patent: 3679950 (1972-07-01), Rutt
patent: 5432378 (1995-07-01), Whitney et al.
patent: 5561587 (1996-10-01), Sanada
patent: 5805409 (1998-09-01), Takahara et al.
patent: 5862034 (1999-01-01), Sato et al.
patent: 6441459 (2002-08-01), Togashi et al.
patent: 6831360 (2004-12-01), Yamaura et al.
patent: 7362559 (2008-04-01), Tominaga
patent: 2001/0035563 (2001-11-01), Masumiya et al.
patent: 2002/0041006 (2002-04-01), Ahiko et al.
patent: 2004-296936 (2004-10-01), None
Clark Jasmine J
Hamre Schumann Mueller & Larson P.C.
Rohm & Co., Ltd.
LandOfFree
Ceramic chip-type electronic component and method of making... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ceramic chip-type electronic component and method of making..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic chip-type electronic component and method of making... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2811027