Absorptive cooling for electronic devices

Details Absorptive cooling for electronic devices Absorptive cooling for electronic devices

2008-07-01

2008-07-01

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C062S259200, C165S080400, C165S104330, C361S699000

Reexamination Certificate

active

07394655

ABSTRACT:
Embodiments of this invention include active electrical components withing a housing that contains an absorptive cooler. The absorptive cooler is used to cool active electrical components, such as central processors or other heat-sensitive components. In some embodiments, heat produced by electronic components can be used to provide heat to the absorptive cooler. By using heat generated from within the housing of the electronic device or other heat-producing element to drive an absorptive cooler, temperatures within heat-sensitive elements, such as a central processing unit can be reduced with a minimum of energy loss, and thereby permitting faster processing speed and reduced power consumption.

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