Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-07-29
2008-07-29
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S723000, C257S724000, C257SE23065
Reexamination Certificate
active
07405475
ABSTRACT:
A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.
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Anderson Ronald L.
Hansen John E.
Youker Nick A.
Cardiac Pacemakers Inc.
Parekh Nitin
Schwegman Lundberg & Woessner, P.A.
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