Structure for fixing an electronic device to a substrate

Details Structure for fixing an electronic device to a substrate Structure for fixing an electronic device to a substrate

2008-06-03

2008-06-03

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C361S792000

Reexamination Certificate

active

07381905

ABSTRACT:
A structure is disclosed for fixing an electronic device having a heat-releasing plate to a substrate. The structure includes a substrate, a land portion which is formed on a front face of the substrate and on which said heat-releasing plate of the electronic device is to be soldered, a through-hole formed in and penetrating said substrate and said land portion. The through-hole is adapted to release heat generated in the electronic device. The structure further includes a partitioning portion provided to be positioned between the heat-releasing plate and the land portion. The partitioning portion is adapted for preventing a solder, which should partially run out from a specific edge portion of the heat-releasing plate on soldering the heat-releasing plate to the land portion, from partially flowing into the through-hole.

REFERENCES:
patent: 6190941 (2001-02-01), Heinz et al.
patent: 6230399 (2001-05-01), Maheshwari et al.
patent: 6441312 (2002-08-01), Tanimura et al.
patent: 2003-318579 (2003-11-01), None

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