Semiconductor device including semiconductor element...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S684000, C257S686000, C257S698000, C257SE23178, C257SE25010

Reexamination Certificate

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07368813

ABSTRACT:
A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an upper insulation film. An upper wiring layer formed on the upper insulation film, and the lower wiring layer formed below the base plate via lower insulation films are connected by conductors. A second semiconductor element is mounted exposed, being connected to the lower wiring layer.

REFERENCES:
patent: 5337027 (1994-08-01), Namordi et al.
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 6222259 (2001-04-01), Park et al.
patent: 6479760 (2002-11-01), Kimbara et al.
patent: 6525414 (2003-02-01), Shiraishi et al.
patent: 6528871 (2003-03-01), Tomita
patent: 6590291 (2003-07-01), Akagawa
patent: 6680529 (2004-01-01), Chen et al.
patent: 6770971 (2004-08-01), Kouno et al.
patent: 6952049 (2005-10-01), Ogawa et al.
patent: 2001/0004130 (2001-06-01), Higashi et al.
patent: 2001/0010627 (2001-08-01), Akagawa
patent: 2002/0017710 (2002-02-01), Kurashima et al.
patent: 2002/0053730 (2002-05-01), Mashino
patent: 2002/0117743 (2002-08-01), Nakatani et al.
patent: 2002/0175402 (2002-11-01), McCormack et al.
patent: 2002/0187588 (2002-12-01), Omizo et al.
patent: 2002/0195700 (2002-12-01), Li
patent: 2003/0062624 (2003-04-01), Asahi et al.
patent: 2004/0056344 (2004-03-01), Ogawa et al.
patent: 2004/0150095 (2004-08-01), Fraley et al.
patent: 2004/0201085 (2004-10-01), Ogawa et al.
patent: 2004/0245614 (2004-12-01), Jobetto
patent: 2005/0218451 (2005-10-01), Jobetto
patent: 1 111 674 (2001-06-01), None
patent: 10-100026 (1998-04-01), None
patent: 11-265975 (1999-09-01), None
patent: 2001-044641 (2001-02-01), None
patent: 2001-094046 (2001-04-01), None
patent: 2001-217337 (2001-08-01), None
patent: 2001-250836 (2001-09-01), None
patent: 2001-274034 (2001-10-01), None
patent: 2001-339165 (2001-12-01), None
patent: 2002-270712 (2002-09-01), None
patent: 2002-280485 (2002-09-01), None
patent: 2002-368184 (2002-12-01), None
patent: 2003-158239 (2003-05-01), None
patent: 2003-188314 (2003-07-01), None
patent: 2003-197849 (2003-07-01), None
patent: 2003-273321 (2003-09-01), None
patent: 2003-318361 (2003-11-01), None

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