Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-05-06
2008-05-06
Warren, Matthew E. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S684000, C257S686000, C257S698000, C257SE23178, C257SE25010
Reexamination Certificate
active
07368813
ABSTRACT:
A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an upper insulation film. An upper wiring layer formed on the upper insulation film, and the lower wiring layer formed below the base plate via lower insulation films are connected by conductors. A second semiconductor element is mounted exposed, being connected to the lower wiring layer.
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Jobetto Hiroyasu
Mihara Ichiro
Wakabayashi Takeshi
Wakisaka Shinji
Casio Computer Co. Ltd.
Frishauf Holtz Goodman & Chick P.C.
Warren Matthew E.
LandOfFree
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