Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2008-03-11
2008-03-11
Crispino, Richard (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S312000, C156S322000, C029S076100, C029S832000
Reexamination Certificate
active
07341642
ABSTRACT:
The present invention provides a method of manufacturing an electric device, wherein an adhesive applied on a flexible wiring board is heated to a first temperature to lower its viscosity to a sufficient level, after which a semiconductor chip is placed onto the adhesive at a preset location, so that no air is trapped in the adhesive. The adhesive is heated to a second temperature higher than the first temperature in a permanent bonding step to increase its viscosity, whereby any remaining voids are removed with residual adhesive being pushed aside. Having no voids in the adhesive, the resultant electric device is highly reliable in respect of conductivity.
REFERENCES:
patent: 6077382 (2000-06-01), Watanabe
patent: 6365840 (2002-04-01), Honda et al.
patent: 6458236 (2002-10-01), Takeshita et al.
patent: 2002/0173145 (2002-11-01), Honda et al.
patent: 1132931 (1996-10-01), None
patent: 1191326 (1998-08-01), None
patent: 2-226738 (1990-09-01), None
patent: 4-302444 (1992-10-01), None
patent: 10-56259 (1998-02-01), None
patent: 11-330162 (1999-11-01), None
patent: 2001-024032 (2001-01-01), None
International Preliminary Examination Report dated Mar. 11, 2003.
International Search Report, dated May 21, 2002.
English Abstract of Published Publication No. 11-330162 dated Nov. 30, 1999.
English Abstract of Published Pubication No. 2001-024032 dated Jan. 26, 2001.
Notification of Transmittal of and English Translation of PCT International Preliminary Examination Report dated Feb. 24, 2003, 4 pages.
Notification of Reason(s) for Refusal dated Dec. 17, 2004 (2 pages) (Japanese version).
English Translation of Notification of Reason(s) for Refusal dated Dec. 17, 2004 (2 pages).
Patent Abstracts of Japan; Publication No. 02-226738 dated Sep. 10, 1990 (1 page).
Patent Abstracts of Japan; Publication No. 04-302444 dated Oct. 26, 1992 (1 page).
Patent Abstracts of Japan; Publication No. 10-056259 dated Feb. 24, 1998 (1 page).
Chinese Application No. 02808793.3; Office Action dated Oct. 28, 2005 (5 pages).
Chinese Application No. 02808793.3 English Translation of Office Action (4 pages), Oct. 28, 2005.
Chinese Application No. 02808793.3 English translation of Office Action dated Oct. 28, 2005 continuing with claim 1 rejection (4 pages).
Crispino Richard
Musser Barbara J.
Osha & Liang LLP
Sony Chemical & Information Device Corporation
Sony Corporation
LandOfFree
Manufacturing method for electric device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing method for electric device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for electric device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2802336