Method for making a circuit plate

Details Method for making a circuit plate Method for making a circuit plate

2008-06-10

2008-06-10

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S835000, C029S846000, C029S847000, C029S848000

Reexamination Certificate

active

07383630

ABSTRACT:
A method for making a circuit plate includes: forming first holes in an insulating layer; forming a conductive layer on the insulating layer such that a portion of the conductive layer fills the first holes; grinding the conductive layer such that the portion of the conductive layer remains in the first holes to form a pattern of conductive traces; forming a dielectric protective layer that covers the insulating layer and the conductive traces; forming a pattern of second holes in the protective layer such that a portion of each of the conductive traces is accessible through a respective one of the second holes; and forming conductive bumps that are respectively connected to the conductive traces.

REFERENCES:
patent: 6678952 (2004-01-01), Jamil
patent: 7174630 (2007-02-01), Hsu et al.
patent: 2001/0040290 (2001-11-01), Sakurai et al.

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