Semiconductor integrated circuit package having electrically...

Details Semiconductor integrated circuit package having electrically... Semiconductor integrated circuit package having electrically...

2008-03-11

2008-03-11

Lewis, Monica (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S734000, C257S737000, C257S738000, C257S784000, C257S787000

Reexamination Certificate

active

07342319

ABSTRACT:
Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

REFERENCES:
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5410181 (1995-04-01), Zollo et al.
patent: 5748450 (1998-05-01), Kim et al.
patent: 5811317 (1998-09-01), Maheshwari et al.
patent: 5898224 (1999-04-01), Akram
patent: 5994166 (1999-11-01), Akram et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6121576 (2000-09-01), Hembree
patent: 6127724 (2000-10-01), DiStefano
patent: 6160715 (2000-12-01), Degani et al.
patent: 6175157 (2001-01-01), Morifuji
patent: 6198162 (2001-03-01), Corisis
patent: 6208156 (2001-03-01), Hembree
patent: 6214716 (2001-04-01), Akram
patent: 6222265 (2001-04-01), Akram et al.
patent: 6225702 (2001-05-01), Nakamura
patent: 6232666 (2001-05-01), Corisis et al.
patent: 6258626 (2001-07-01), Wang et al.
patent: 6326244 (2001-12-01), Brooks et al.
patent: 6329222 (2001-12-01), Corisis et al.
patent: 6329637 (2001-12-01), Hembree et al.
patent: 6391762 (2002-05-01), Gamota et al.
patent: 6400574 (2002-06-01), Stephenson et al.
patent: 6462420 (2002-10-01), Hikita et al.
patent: 6500764 (2002-12-01), Pritchett
patent: 6503781 (2003-01-01), Stephenson et al.
patent: 6504389 (2003-01-01), Hembree et al.
patent: 6507114 (2003-01-01), Hui et al.
patent: 6522018 (2003-02-01), Tay et al.
patent: 6533159 (2003-03-01), Cobbley et al.
patent: 6559537 (2003-05-01), Bolken et al.
patent: 6576495 (2003-06-01), Jiang et al.
patent: 6576496 (2003-06-01), Bolken et al.
patent: 6577004 (2003-06-01), Rumsey et al.
patent: 6583502 (2003-06-01), Lee et al.
patent: 6595408 (2003-07-01), Cobbley et al.
patent: 6599822 (2003-07-01), Akram
patent: 6600335 (2003-07-01), Tay et al.
patent: 6602733 (2003-08-01), Iwahashi et al.
patent: 6603071 (2003-08-01), Takao
patent: 6638792 (2003-10-01), Hui et al.
patent: 6646286 (2003-11-01), Akram
patent: 6660558 (2003-12-01), Boken et al.
patent: 6661103 (2003-12-01), Akram
patent: 6661104 (2003-12-01), Jiang et al.
patent: 6680213 (2004-01-01), Farnworth et al.
patent: 6687989 (2004-02-01), Farnworth et al.
patent: 6700183 (2004-03-01), Jiang
patent: 6724084 (2004-04-01), Hitika et al.
patent: 6736306 (2004-05-01), Byun et al.
patent: 6750552 (2004-06-01), Narayanan
patent: 6762495 (2004-07-01), Reyes et al.
patent: 6778404 (2004-08-01), Bolken et al.
patent: 6781245 (2004-08-01), Huang
patent: 6825569 (2004-11-01), Jiang et al.
patent: 6889430 (2005-05-01), Jiang et al.
patent: 7268067 (2007-09-01), Hall et al.
patent: 2002/0100976 (2002-08-01), Hui et al.
patent: 2002/0114135 (2002-08-01), Akram et al.
patent: 2002/0149298 (2002-10-01), Furukawa et al.
patent: 2002/0167077 (2002-11-01), Vincent
patent: 2002/0187590 (2002-12-01), Bolken et al.
patent: 2002/0195718 (2002-12-01), Imasu et al.
patent: 2003/0027377 (2003-02-01), Owens
patent: 2003/0116866 (2003-06-01), Cher'Khng et al.
patent: 2003/0193088 (2003-10-01), Hall et al.
patent: 2004/0004292 (2004-01-01), Hsieh et al.
patent: 2004/0084771 (2004-05-01), Bolken et al.
patent: 2004/0164412 (2004-08-01), Bolken et al.
patent: 2004/0200885 (2004-10-01), Derderian
patent: 2004/0212067 (2004-10-01), Wang
patent: 2005/0019983 (2005-01-01), Bolken et al.
patent: 2005/0026327 (2005-02-01), Hall et al.
patent: 2345191 (2000-06-01), None
patent: 09-232375 (1997-09-01), None
patent: 2003-234435 (2003-08-01), None
patent: 2001027290 (2001-04-01), None
“Final office action mailed Dec. 2, 2003 in U.S. Appl. No. 10/123,827”, 24 pgs.
“Non-final office action mailed Mar. 31, 2003 in U.S. Appl. No. 10/123,827”, 23 pgs.
“Non-final office action mailed Oct. 15, 2004 in U.S. Appl. No. 10/123,827”, 22 pgs.
“Non-final office action mailed Oct. 20, 2005 in U.S. Appl. No. 10/929,283”, 11 pgs.
“Non-final office action mailed Oct. 31, 2006 in U.S. Appl. No. 10/929,283”, 7 pgs.
“Non-final office action mailed Nov. 17, 2006 in U.S. Appl. No. 10/123,827”, 18 pgs.
“Non-final office action mailed Dec. 16, 2005 in U.S. Appl. No. 10/123,827”, 23 pgs.
“Notice of allowance mailed Apr. 10, 2006 in U.S. Appl. No. 10/929,283”, 7 pgs.
“Notice of allowance mailed May 4, 2007 in U.S. Appl. No. 10/123,827”, 5 pgs.
“Notice of allowance mailed May 4, 2007 in U.S. Appl. No. 10/929,283”, 4 pgs.
“Notice of allowance mailed May 5, 2005 in U.S. Appl. No. 10/123,827”, 9 pgs.
“Resp filed Jan. 20, 2006 to non-final office action mailed Oct. 20, 2005 in U.S. Appl. No. 10/929283”, 12 pgs.
“Response filed Jan. 18, 2005 to non-final office action mailed Oct. 15, 2004 in U.S. Appl. No. 10/123,827”, 14 pgs.
“Response filed Jan. 24, 2007 to non-final office action mailed Oct. 31, 2006 in U.S. Appl. No. 10/929283”, 9 pgs.
“Response filed Jan. 17, 2007 to Non-Final Office action mailed Nov. 17, 2006 in U.S. Appl. No. 10/123,827”, (Jan. 17, 2007),9 pages.
“Response filed Mar. 16, 2006 to non-final office action mailed Dec. 16, 2005 in U.S. Appl. No. 10/123,827”, 17 pgs.
“Response filed Mar. 2, 2004 to Final Office action mailed Dec. 2, 2003 in U.S. Appl. No. 10/123,827”, (Mar. 2, 2004),12 pages.
“Response filed Jul. 30, 2003 to Non-Final Office action mailed Mar. 31, 2003 in U.S. Appl. No. 10/123,827”, (Jul. 30, 2003),10 pages.
Fan, L., et al., “Incorporation of Inorganic Filler into the No-Flow Underfill Material for Flip-Chip Application”,International Symposium on Advanced Packaging Materials, (2000), 303-310.

Affiliated with

Also associated with

Rating

Semiconductor integrated circuit package having electrically... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor integrated circuit package having electrically..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit package having electrically... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2801918