Method and apparatus for electrically connecting printed...

Details Method and apparatus for electrically connecting printed... Method and apparatus for electrically connecting printed...

2008-06-10

2008-06-10

Patel, Ishwar I. B. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C029S852000, C029S417000

Reexamination Certificate

active

07385144

ABSTRACT:
A method and apparatus is provided for forming a printed circuit board or other panel in which an array of vias are arranged in a desired connection grid within one or more layers of the board and then the board and vias are cut to form an edge of the board where a surface of the vias is exposed. The board may be orthogonally mounted on its edge to another thin circuit board or aperture sheet with the exposed surface of each via directly connected to such other board or sheet.

REFERENCES:
patent: 6005766 (1999-12-01), Muraki
patent: 6021048 (2000-02-01), Smith
patent: 6472744 (2002-10-01), Sato et al.
patent: 6487086 (2002-11-01), Ikeda
patent: 6534726 (2003-03-01), Okada et al.
patent: 7189083 (2007-03-01), Seidler et al.
patent: 2004/0233024 (2004-11-01), Almeida et al.
patent: 2006/0042831 (2006-03-01), Rohde et al.

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