Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2008-03-18
2008-03-18
Kebede, Brook (Department: 2823)
Semiconductor device manufacturing: process
With measuring or testing
C438S462000, C257S620000, C257SE21523
Reexamination Certificate
active
07344899
ABSTRACT:
A method for forming a die on a wafer is provided. The method includes forming on a wafer a die having an active portion that includes integrated circuitry. The method further includes forming at least one input bond pad on the active portion and at least one test pad on the die. A conductive path is formed between the input bond pad and the test pad. A portion of the conductive path is formed on the die outside of the active portion of the die.
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Applicant is not aware of any patents, publications, or other information for consideration by the patent office.
Fletcher Yoder PC
Kebede Brook
Micro)n Technology, Inc.
Nguyen Khiem D
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