Heating device for manufacturing semiconductor

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Reexamination Certificate

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C219S444100, C118S728000

Reexamination Certificate

active

07999210

ABSTRACT:
A heating device for manufacturing semiconductor capable of uniformly heating a wafer or other materials to be treated, and in particular a heating device in a coater-developer used for heat-hardening of resin film for photolithography and for heat-calcining of low-dielectric constant insulating film, is provided.A device of this invention comprises a ceramic holder1having a resistive heating element2embedded therein, which holds and heats a wafer6or another material to be treated; a cylindrical support member4which supports the ceramic holder1; and a chamber5which houses these. The support member4and ceramic holder1are not hermetically sealed, or alternatively the atmospheres within the cylindrical support member4and within the chamber5are maintained to be substantially the same by adjusting the introduction and evacuation of gas.

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