Thermal relief mechanism for combination-type heat exchangers

Heat exchange – Three non-communicating fluids

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S081000

Reexamination Certificate

active

07360584

ABSTRACT:
A multi-fluid heat exchanger and a method of making the same are provided wherein a cut portion is provided in an elongated header of the heat exchanger at a location between a pair of baffles in the elongated header and first and second cores of the heat exchanger. At least a majority of the transverse cross section of the elongated header is removed at the cut portion to allow for relative thermal growth of the first and second cores.

REFERENCES:
patent: 5954123 (1999-09-01), Richardson
patent: 6412547 (2002-07-01), Siler
patent: 2002/0040776 (2002-04-01), Kokubunji et al.
patent: 2003/0213587 (2003-11-01), Mano et al.
patent: 2005/0006069 (2005-01-01), Kamiyama et al.
patent: 2005/0133207 (2005-06-01), Scoville et al.
patent: 1 477 757 (2004-11-01), None
patent: 1 477 758 (2004-11-01), None
patent: 1 477 760 (2004-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal relief mechanism for combination-type heat exchangers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal relief mechanism for combination-type heat exchangers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal relief mechanism for combination-type heat exchangers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2793379

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.